FPC flexible circuit boards need to do the test
1. Thermal stress test: the purpose is to verify that the heat resistance of the FPC board.
2. Half-field adhesion test: The purpose is to verify whether the FPC board is good at eating tin.
3. Environmental testing (thermal shock): the purpose is to verify that the FPC board can be stored in a harsh environment with drastic temperature changes to maintain good performance.
4. Plating adhesion test: the purpose is to verify that the FPC board plating adhesion is good.
5. Environmental test (high temperature and high humidity): is to verify that the FPC board in high temperature and high humidity environment can maintain good performance.
6. Folding test: the purpose is to verify that the FPC board around the bending angle can maintain good performance
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