PMC (Private Millitary Contractor), that is, "Private Military Contractor". It is different from what is commonly known as a security company. Private military contractors have been around for a long time in Western military history. The Continental Army during the American Revolutionary War relied heavily on private military contractors to provide transportation, carpentry, mechanical maintenance, and services related to food and medicine. The Marquis de Lafayette of France was one of the first military contractors to serve the U.S. Army, purchasing and outfitting a warship and joining in direct combat with the British. After World War II, the U.S. military, gradually equipped with a variety of high-tech weapons, relied increasingly on private military contractors, and the Vietnam War was even called a "war under contract.
Today, private military contractors not only undertake the logistics of the U.S. military, but also involved in combat missions and diplomatic activities. According to the Brookings Institution, one private military contractor employee supports every 10 U.S. soldiers in Iraq. Currently, 28 per cent of the maintenance of the United States Army's weapons and equipment is carried out by private military contractors, and in the future this percentage could rise to 50 per cent. By providing services to the United States military, private military contractors make huge profits. Some PMSC employees on war defense missions in Iraq can earn up to $1,000 a day, and a truck driver for a PMSC can earn about $80,000 a year tax-free.
PMC-Portable Media Center
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PMC is an acronym for "Portable Media Center ". Microsoft has unified the hardware specifications of PMC, the CPU adopts XScale provided by Intel, and the overall software framework is Microsoft's "Windows Portable Media Center" operating system. It seems that this time the WIN-TEL camp will enter the portable media market again, creating a portable media player.
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DIP package (Dual In-line Package), also known as dual in-line package technology, dual in-line package, a DRAM component package form. Dual In-line Package (DIP) refers to an integrated circuit chip packaged in the form of a dual in-line package, the vast majority of small and medium-sized integrated circuits use this form of packaging, and the number of pins is generally no more than 100. DIP packaged CPU chips have two rows of pins, which need to be inserted into a chip socket with a DIP structure. Of course, can also be directly inserted in the same number of holes and geometric arrangement of the circuit board for welding.DIP package chip from the chip socket should be inserted and removed with special care, so as not to damage the pins.DIP package structure form: multi-layer ceramic double in-line DIP, single ceramic double in-line DIP, lead frame DIP (including glass-ceramic sealing, plastic encapsulated structural, ceramic and low-fusing glass package) and so on. glass package type), etc.
DIP package has the following characteristics:
Suitable for PCB (printed circuit board) on the through-hole soldering, easy to operate.
The ratio between chip area and package area is large, so the volume is also large.
The earliest CPUs, such as 4004, 8008, 8086, 8088, etc., used DIP packages, which could be inserted into slots on the motherboard or soldered to the motherboard through the two rows of pins on them.
The DIP package was popular in the days when memory chips were inserted directly onto the motherboard. DIP also has a derivative, SDIP (Shrink DIP, Shrink Dual Inline Package), which is six to six times denser than DIP.
DIP is also the abbreviation of the dip switch, its electrical characteristics
1. electrical life: each switch in the voltage 24VDC and current 25mA under the test, can be toggled back and forth for 2000 times;
2. switch infrequent switching rated current: 100mA, withstand voltage 50VDC;
3. switching often switching rated current Contact impedance: (a) Initial value 50mΩ max; (b) Maximum value 100mΩ after test;
5. Insulation impedance: 100mΩ min, 500VDC;
6. Voltage strength: 500VAC/1minute;
7. Inter-pole capacitance: 5pF max;
8. Circuit: single contact single choice: DS(S), DP(L).
Additionally, the digital aspect of the movie
DIP (Digital Image Processor) quadratic actual image