Circuit board vulcanization refers to the process of laminating a multi-layer printed circuit board into a solid by the action of high temperature and pressure. Its purpose is to achieve the circuit board with rigidity, heat resistance, corrosion resistance and other properties, so as to meet the use of electronic equipment in complex environments. Circuit board vulcanization technology is one of the necessary links in the manufacturing process of printed circuit boards.
The process of circuit board vulcanization generally includes the following steps: first of all, the circuit board on the copper foil, antioxidant coatings and other insulating materials together with the molding of a single layer of printed circuit boards; and then multi-layer circuit boards are laminated together; through the prototype machine tools such as pre-cutting of the circuit board, which is divided into independent boards; and then finally drilling holes, so that the board on the connectivity between the various points.
The circuit board vulcanization technology is widely used in the production of various types of electronic equipment, such as computers, communication equipment, medical instruments and so on. Especially in high-performance electronic devices, the application of circuit board vulcanization technology is crucial, because it can ensure the stability and reliability of the performance of electronic devices. With the continuous development of electronic packaging technology, circuit board vulcanization technology is also constantly optimized and upgraded, and gradually towards the direction of high density, high reliability, high insulation, high signal transmission rate.