Low-pressure injection molding process is a very low injection pressure (1.5 ~ 40bar) will be encapsulation material into the mold and rapid curing molding (5 ~ 50 seconds) encapsulation process method, in order to achieve insulation, temperature resistance, impact resistance, vibration damping, moisture, waterproof, dust, chemical corrosion and other effects. Henkel Technologies provides high-performance Technomelt series special hot melt adhesives as encapsulation materials for this process, which are mainly used for encapsulation and protection of precise and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, cellular phone batteries, wiring harnesses, waterproof connectors, sensors, microswitches, inductors, antennas, ring cords, and so on.
Extremely low injection pressure, no damage to components, extremely low defective rate
For the defects of traditional injection molding process pressure is too high, Technomelt series of special adhesive in the melt only needs a very small pressure can be made to flow into a very small space of the mold, and thus will not damage the need to encapsulate the fragile components, greatly reducing the rate of scrap.