Thermal insulation resistance: a. At room temperature: >=500M ohm. b. After wet heat treatment: >=100M ohm.
Solderability: 260±5℃, 3~5s, 100% wetting.
Thermal shock test: 260±5℃*10s*3 times, oozing sn. no delamination, no bubbles.
FPC flexible board in the smart phone application number is more, battery, screen, fingerprint module, camera need to use FPC, FPC flexible board of the basic test standards are:
1. Substrate film surface, cover layer appearance;
2. Succession plate and cover layer deviation, the binder and cover layer of the flow of infiltration, cover layer of the conductor under the discoloration;
3. temperature and humidity resistance, voltage resistance, bending resistance, welding resistance to meet the requirements;
4. poor plating bonding, coating layer leakage and so on.
FPC voltage test needs to be connected to the circuit, test its current transmission capacity and the ability to withstand the voltage, high-current slug micro-pin module as a connection module, can be in the range of 1-50A, the current transmission and conduction, overcurrent capacity, but also has a stable connectivity. Not only strong conductivity, in the field of small pitch, also has a reliable response, can be adapted to the pitch value between 0.15mm-0.4mm, contact stability does not card pin, the average service life can reach more than 20w times.