1. Incoming PCB materials must be packed in a vacuum (moisture-proof desiccant is included).
2. Large areas of fingerprints, water marks and other unclean oily PCBs are not allowed on the solder mask surface.
3. The pad offset and pad damage shall not be greater than 20r of the original pad specification. No cracks or breaks in any substrate substrate are allowed.
4. Any substrate substrate is not allowed to have loose lamination, obvious delamination, etc. i. The solder pad part must not be severely oxidized, exposed copper, or stained with oil, which will hinder the soldering of the pad. Of.
5. Gold fingers and chip pads do not require circuit repair.
6. The gold finger part is not allowed to have pinholes, toothed edges or scratched appearance h. Non-line conductors (residual copper) must be more than 2mm away from the line, the area must be less than 1mm, and the length must be less than 2mm, and Does not affect electrical performance.
7. The exposed copper area shall not be larger than 2mm, and no copper shall be exposed between two adjacent lines at the same time.
8. Open circuits and short circuits are not allowed on the lines. The length of the burrs on the edges of the lines shall not be greater than 1mm, and the chipped corners or defective areas shall not be greater than 10% of the original line width.
9. The PCB is not allowed to warp more than 0.5mm (horizontal plane).
10. There should be no more than 2 line repair lines, and their length is less than 3mm. Adjacent lines are not allowed to be repaired at the same time. After the repair lines are baked in a tin furnace and high temperature, the lines and solder resist must not be repaired. There is peeling and blistering.
11. The gold-plated surface shall not be stained with tin, paint or unclean oil stains, etc. d. The line width shall not be less than 80% of the original line width.
12. The gold finger must be golden yellow, and there must be no obvious discoloration or blackening. The text, component number, symbol and other markings on the surface of the part must not be incomplete or unrecognizable.
13. The gold finger part is not allowed to expose copper, nickel, etc. b. PCB bulk incoming materials are not allowed to provide defective products with a difference of more than 10 dozen.