What are the advantages of heat pipe radiators?
Heat pipe radiator is the use of heat pipe technology can be many old radiators or heat transfer products and systems to make significant improvements and produce new products. Heat pipe radiator has natural cooling and forced air-cooled two categories. Air-cooled heat pipe radiators have a much smaller thermal resistance and are commonly used in high power supplies. A heat pipe radiator consists of a sealed tube, a liquid-absorbing core and a vapor channel. The liquid-absorbing core surrounds the wall of the sealed tube and is impregnated with a saturated liquid that can be volatilized. This liquid can be distilled water, or ammonia, methanol, or acetone. Heat pipe radiators filled with liquids such as ammonia, methanol, acetone, etc. still have good heat dissipation capability at low temperatures. When the heat pipe radiator is in operation, its evaporation section absorbs the heat generated by the heat source (power semiconductor device, etc.), so that the liquid in its liquid-absorbing core tube boils into vapor. With the heat of the vapor from the evaporation section of the heat pipe radiator to the cooling section to move, when the vapor heat transfer to the cooling section, the vapor condenses into liquid. Condensed liquid will be through the wall of the suction core of the capillary effect of the return to the evaporation section, so repeat the above cycle of continuous heat dissipation. Heat pipe radiator is a kind of high-efficiency radiator, which has unique heat dissipation characteristics. That is, it has a high thermal conductivity, its evaporation section and cooling section of the temperature distribution along the axial direction is uniform and basically equal. The thermal resistance of a radiator is determined by the thermal conductivity of the material and the effective area within the volume. Solid aluminum or copper heat sink in the volume of 0.006m? when, and then increase its volume and area can not significantly reduce the thermal resistance. For double-sided heat dissipation of discrete semiconductor devices, air-cooled all-copper or all-aluminum heat sink thermal resistance can only reach 0.04 ℃ / W.? ?