1. Cutting: Cut the big material into small material according to the size of MI requirements.
2.
Inner layer: paste dry film or printing oil, exposure punch etching and retiring film inner layer etching inspection is a graphic transfer process, through the use of film negative, ink / dry film and other media in the UV light, the customer needs the line graphics production in the inner layer of the substrate, and then the unwanted copper foil etched off, and ultimately made into the inner layer of conductive lines.
3.
Pre-treatment: grinding board, inner dry film inner etching internal inspection + roughening the surface of the copper board, in order to help increase the board surface and the bonding force of the drug film + clean the board, remove the board surface debris dry film and copper foil coverage ink and copper foil coverage.
4. Platen process: browning, lining up the plate, pressing, X-RAY punching, holes and gong edges.
5. Drilling process: The role of drilling is to produce a hole in the circuit board to allow the completion of a post-process to connect the circuit board's upper/lower or intermediate circuit layers between the conductive properties of the channel.
6.
Wet process: copper sinking - outer dry film - graphic plating or plate plating - outer - etching board - outer - etching inspection. The role of copper deposition is to deposit a layer of conductive copper layer on the hole wall of the circuit board insulation, conduction and the inner layer of the line connection. The outer layer of dry film is a dry film exposed to develop a shadow. The role of graphic plating or plate plating is to increase the copper thickness of the circuit board holes \ line \ surface, so that it meets the customer's requirements. The outer layer of etching and desmear is the use of strong alkali can make the dry film dissolved or stripped nature of the unwanted dry film from the board stripped or dissolved. Etching is the use of divalent copper ammonium complex and the oxidizing property of ions to etch off unwanted copper from the board. Tin removal is to remove tin from the board by utilizing the nitric acid in the tin removing water to react with the tin and dissolve the tin plating layer. Outer layer inspection is through the AOI& VRS through the CCD scanning ingested board image, the use of computers and CAM standard graphics into the comparison and design specifications for the logical processing of the circuit board on the bad point marking out the coordinates of the bad point will be transmitted to the VRS, and ultimately to confirm the location of bad points.
7.
Wet film process: the main process is to have molded the outer layer of the circuit board road surface printing on a layer of photographic ink to make it cured in order to achieve the protection of the outer layer of the circuit board and the role of insulation. Pre-processing grinding board, ink printing, oven exposure and imaging, character printing.
8. surface treatment process: mainly in accordance with customer requirements, the circuit board exposed copper surface for a layer of processing. The main treatment processes are spray tin, immersion tin, immersion silver, immersion gold, gold plating and anti-oxidation.
9. Molding process: mainly according to customer requirements, a circuit board has been formed, processed into the size and shape of the customer needs.
10. Open and short circuit testing and checking: Mainly checking the open and short circuit of the line, and checking the quality of the board surface by eyesight.
11. Packing and shipping: the qualified board will be packaged and finally shipped to customers.
11.