What are the common heat dissipation and cooling materials for mobile communication terminal equipment?

Currently 5G mobile communication equipment common cooling materials are:

1, artificial graphite sheet

Thickness is thin, up to 0.017mm; high thermal conductivity, thermal conductivity in the 1500-2000w/m.k; thermal conductivity is very good, the price is slightly higher.

Li Wang new materials artificial graphite sheet common application industries: cell phones and other electronic products, communication industry, notebook, medical equipment, LED substrate cooling.

2, metal backsheet (film)

The thermal conductivity area is large, the metal thermal conductivity is high, can quickly dissipate heat; wide range of uses, good texture, good heat dissipation effect; but low strength, easy to break.

Li Wang new materials metal backsheet (film) material common application industries: cell phones and other electronic products, medical equipment, industrial production and other cooling.

3, thermal conductive gel

Soft and has a good affinity; no obvious hardness, does not produce internal seating force on the device; weak adhesive force, can not be used to fix the heat sink.

Li Wang new materials thermal conductive gel common application industries: cell phones and other electronic products, electrical equipment, heat dissipation facilities, such as cooling.

4, phase change cooling materials

Solid-solid phase change or solid-liquid phase change materials, can conduct heat can also absorb pastoral heat; can meet the thinner body, the processor part of the heat consumption, heat dissipation and cooling effect is good; but at present, the phase change material cost is high.

Li Wang new materials cooling phase change materials common application industries: 5G communication equipment, cell phones and other electronic products, electrical equipment, such as cooling.

Of course, ordinary mobile terminals also use different heat dissipation material programs, but 5G mobile communication equipment heat generation has far exceeded the 4G, the heat dissipation material and program requirements are increasingly high.