1, the laser marking machine field mirror into a small range of field mirrors, transformed, the depth of its marking will also be deeper, such as the current semiconductor laser marking machine are able to pass through the 110 field mirror, into a 50 field mirror, the total laser energy and engraving depth will be reached before the effect of about 2 times;
2, Will increase the power of the laser marking machine, this is one of the most direct way to adjust;
3, will be slowing down the laser marking machine marking speed, the same power, the same other parameters, just modify the speed of the marking, marking the depth of course, will be a little deeper;
4, will be a laser marking machine laser mode to become better, its marking depth also has a certain level of enhancement, for example, semiconductor laser marking machine, together with the laser marking machine, the depth of the marking depth will also have some improvement. Semiconductor laser marking machine, plus a small hole, increase the precision of refrigeration, adjust the laser mode out of the light, so that the laser is the largest, the most round, the brightest;
5, the replacement of imported field mirrors can also marking depth of the engraved words become deeper. For example, semiconductor laser marking machine using German lens, CO2 lens is used in the United States two six uniform head, can rise to a certain depth;
6, replacement of lasers, change the success rate of more of the ground species of lasers, laser marking machine directly the depth of the engraving to enhance;
7, replacement of better laser marking accessories, such as semiconductor laser marking machine, then, the use of imported Q switch, its marking depth will be better.
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