The main components of a chip are as follows:
The main components of a chip are semiconductor materials, including silicon, germanium, gallium arsenide, and so on. Among them, silicon is the most commonly used semiconductor material because it is abundant, cheap, easy to process, and has good electrical and mechanical properties. Semiconductor materials in chips are usually categorized into two types: P-type semiconductors and N-type semiconductors.
Heteroatoms in P-type semiconductors (e.g., boron) can accept electrons to form holes; heteroatoms in N-type semiconductors (e.g., phosphorus) can provide electrons to form free electrons. Stacking P-type semiconductors and N-type semiconductors together creates a PN structure, which realizes the basic function of a semiconductor device.
In addition to the semiconductor material, the chip includes components such as metal wires, insulating layers, capacitors, inductors, diodes, and transistors. These components are combined together through the PN structure of the semiconductor material to form a variety of circuits that realize different functions.
Chip use areas and manufacturing process:
I. Chip manufacturing process
1, wafer preparation: wafers are the basic material for chip manufacturing, usually made of silicon. Wafer preparation process includes selection, cutting, polishing and other steps.
2, wafer cleaning: the surface of the wafer needs to be strictly cleaned to remove impurities and contaminants to ensure chip quality.
3, wafer on photolithography: the use of photolithography, the wafer surface coated with photoresist, and then through the photolithography machine will be the chip graphics projected on the photoresist to form the graphics of the chip.
4, etching: the wafer into a chemical solution, so that the photoresist is etched away, exposing the semiconductor material on the wafer, forming the circuit structure of the chip.
5, deposition: through the chemical vapor deposition or physical vapor deposition technology, deposited on the surface of the chip metal or insulating layer, the formation of the chip's wires and insulating layer.
6, electroplating: metal plating on the chip surface to enhance the chip's electrical conductivity and mechanical strength.
7, encapsulation: the chip into the encapsulation material to form the chip shell, in order to protect the chip and easy to use. Encapsulation materials usually include plastic, ceramics, metal, etc..
Two, the application of the chip
1, computer: the chip is the core components of the computer, including the central processing unit (CPU), memory, graphics cards, chipsets and so on.
2, communications: chip applications in the field of communications, including mobile communications, satellite communications, fiber optic communications, such as cell phone chips, base station chips, fiber optic transceiver chips.
3, consumer electronics: chip in the field of consumer electronics applications include smart phones, tablet PCs, smart TVs, audio, etc..
4, medical: chip applications in the medical field, including medical equipment, biochips, health monitoring, etc..
5, automotive: chip applications in the automotive field include engine control, safety control, in-car entertainment, etc..