One is technology, the other is device
Surface mount technology SMT
Surface mount technology, called "Surface Mount Technology" in English, abbreviated SMT is a circuit assembly technology that attaches and welds surface mount components to specified positions on the surface of a printed circuit board. The circuit boards used are made without unreasonable drilling. Specifically, solder paste is first applied to the printed circuit board circuit board, and then the surface mount components are accurately placed on the pads coated with solder paste, and the printed circuit board is heated until the solder paste melts and cooled. Then the interconnection between components and printed boards was realized. In the 1980s, SMT production technology became increasingly perfect. Components used in surface mounting technology were mass-produced and prices dropped significantly. Various equipment with good technical performance and low price became available one after another. Electronic products assembled with SMT are small in size. With the advantages of good performance, full functions, and low price, SMT, as a new generation of electronic assembly technology, is widely used in electronic products in various fields such as aviation, aerospace, communications, computers, medical electronics, automobiles, office automation, and household appliances. Assembling in progress.
SMD Surface Mounted Devices
“In the early stages of electronic circuit board production, via assembly was completely done manually. After the first batch of automated machines were launched, They can accommodate some simple pinned components, but complex components still require manual placement for wave soldering. Surface mount components were introduced about two decades ago and ushered in a new era from passive components to active. Components and integrated circuits eventually became surface mount devices (SMDs) and could be assembled using pick-and-place equipment. For a long time, it was thought that all pinned components would eventually be packaged in SMDs. >