The deposition rate of electroless copper plating on LDS antenna is very slow. What is the main reason?

In the production process of using chemical copper plating additives, sometimes the bath composition is clearly analyzed and all operating parameters are within the process range, but the deposition speed of the coating is still very slow. This is because the process of using chemical copper plating additives is still relatively backward, or the technical formula ratio is unreasonable, which makes the deposition speed of the workpiece slow. In this case, even if the pH value of the electroplating solution increases, the deposition speed of the coating is relatively slow, which leads to low production efficiency.