Laser processing mainly corresponds to the material below 0.1mm, the electronic industry has been widely used in laser processing technology. For example, precision electronic components, integrated circuit chip leads and multi-layer circuit board welding; hybrid integrated circuits in the ceramic substrate or gemstone substrate drilling, scribing and slicing; semiconductor processing processes in the laser away from the domain of heating and annealing; laser etching, doping and oxidation; laser chemical vapor deposition. But as the micro-hole processing of metal, laser has the problem that it will produce some burning black phenomenon, easy to change the material material, as well as residue is not easy to clean up or can not be cleaned up phenomenon. It is not a perfect solution for microporous processing. If the requirements are not high, you can try, but for bulk orders, laser processing will not be able to meet the customer's expectations of delivery and cost.
Wire cutting is to take the wire electrode continuous wire supply mode, that is, the wire electrode in the process of movement to complete the processing, so even if the wire electrode loss, but also continuously to be replenished, so it can improve the accuracy of parts processing. The surface roughness of the workpiece processed by the slow-feeding wire cutting machine can usually reach Ra = 0.8μm and above, and the roundness error, straightness error and dimensional error of the slow-feeding wire cutting machine is much better than that of the fast-feeding wire cutting machine, so in the processing of high-precision parts, the slow-feeding wire cutting machine has been widely used. But for microporous processing, the use of wire cutting process material is easy to deformation, if the mass production, wire cutting can not cope with, and expensive, customers are generally difficult to receive.
Etching, also known as photochemical etching, refers to the exposure, after the development of the protective film to be etched area to be removed, in contact with the chemical solution in the etching, the use of the two positive graphic from the two sides of the chemical abrasive to achieve the role of the dissolution of the formation of concave-convex or skeletonized molding effect. Etching is very specific and refers to controlled corrosion, which is a controlled processing method in which metals are chemically processed. With the development of electronic technology, more and more need many sets of complex shapes, high precision requirements and machining is difficult to realize the ultra-thin shape of the workpiece. The chemical etching method is easy to achieve parts flat, burr-free, complex graphic requirements, and short processing cycle, low cost. Its chemical principle is to use ferric chloride aqueous solution as a corrosive agent and metal reaction.