- DIP, which is called Dual In-line Package, is a packaging form of electronic components. DIP
packaged devices have the form of in-line package with parallel arrangement on both sides of pins. This packaging method was widely used in the early days, but it is rare now.
- SMT is called Surface-Mount Technology, which means surface mount technology. SMT
is an assembly method of electronic components, by directly soldering components on the surface of printed circuit board (PCB), such as chip resistance, chip capacitance, etc. Compared with traditional DIP package, SMT
is more suitable for high-density circuit design because it takes up less space and provides better electrical performance.
- SMD, full name is Surface-Mount Device, that is, surface mount device. SMD is an electronic device with small physical size and high pin package density. SMD
may include various elements, such as integrated circuit chips, diodes, transistors, and the like. SMD package is usually surface mounted by SMT technology.
to sum up, DIP is a packaging form, SMT is an assembly technology, and SMD is a device with high-density pin package. They are widely used in the electronic field.