Hui Disk Automation Technology Co., Ltd. has successfully developed a patented product automatic plasma nano-polishing equipment. Plasma nano-polishing is a new metal surface treatment process - only in the molecular layer on the surface of the workpiece and the plasma reaction, the molecules in the atom is generally spaced 0.1-0.3 nanometers, the treatment depth of 0.3-1.5 nanometers. The surface roughness of the polished object is in the range of 1mm, so the plasma nano-polishing treatment can chemically activate the surface of the workpiece, remove the surface molecular contamination layer and cross-link the surface chemicals. Fai Disk further developed the nano polishing liquid formula, in the polishing liquid cost is further reduced, so that the polishing effect is further optimized
Plasma polishing principle
Plasma is also known as the fourth state of matter, is an electromagnetic gaseous discharge phenomenon, so that gaseous particles are partially ionized, and this ionized gas includes atoms, molecules, atomic clusters, ions, and electrons. Plasma is at high temperature and high pressure, polishes water soluble, at high temperature and high pressure, electrons will be out of the nucleus and run out, the nucleus of the atom formed a positively charged ions, when these ions reach a certain number of times can become a plasma state, plasma state is very high in energy, when these plasma and to be polished object friction, in a moment, will enable the object to achieve the effect of a bright surface.