1. Process Principle: Evaporation coating refers to the evaporation of solid materials into a gaseous state under vacuum, and the growth of thin films is achieved through the deposition of substances. Sputtering coating, on the other hand, is the use of ion bombardment to make the surface of the target material sputtering particles, and deposited on the surface of the substrate to form a thin film.
2. Application: evaporation coating is mainly used in optics, semiconductors, medical and other fields, resulting in a flat film morphology, but the composition of the uniformity of the poor; and sputtering coating is mainly used in the preparation of conductive film, magnetic film, anti-reflective film, etc., with good compositional uniformity and crystallization properties.
3. Types of materials that can be deposited: evaporation coating can deposit a narrower range of materials, limited to volatile substances; while sputtering coating can use a variety of substances, including metals, oxides, silicon and other compounds, can prepare a variety of functional films.
4. Production cost: evaporation coating usually requires less equipment and relatively low cost; while sputtering coating requires more complex and expensive equipment and technology, and the production cost is higher than evaporation coating.