1, COF (Chip On Flex, or, Chip On Film), often referred to as the crystal laminate film, is the integrated circuit (IC) fixed in the flexible circuit board on the grain of the flexible film assembly technology.
The use of flexible add-on circuit boards as encapsulated chip carrier will be combined with the chip and flexible substrate circuitry, or a single reference to the unencapsulated chip of the flexible add-on circuit boards, including tape-and-reel packaging production (TAB substrate, the process is called TCP), flexible board connected to the chip assembly, flexible IC carrier board packaging.
2, COF index, known as the waste of talent index. This index is generated because of the team when someone in the team level higher than my 7 or more, (after the revision of Chapter 8, including their own family or master) when the number of team members higher than my 7 or more will also rise COF.
Applications and development trends
COF in addition to connecting the panel function, but also can carry the active and passive components, so that the product is more lightweight and thinner. Currently COF technology has been successfully applied to LCD panels, and is expected to quickly become the mainstream of the future market, driven by the continuation of products such as cell phones, notebook computers, and LCD monitors. Moreover, due to the COG technology in the joining process due to stress concentration caused by glass deformation, problems occur when the return to repair difficulties.
And TAB technology using three-layer adhesive substrate, flexibility and stability are not as good as COF, so COF is considered to be the next generation of packaging technology to replace the COG and TAB, the product line will be from the cell phone and other small-sized panels, the development of a variety of large and medium-sized panels, and even in the plasma panels and the future of the organic light-emitting panels will also have important applications.
In addition, people can install more than one IC chip on the FPC substrate, constituting the MCM COF, to further improve the packaging density; the application of reel-to-reel (reel-to-reel) production methods, can significantly save costs, improve yields, and reduce human error, so that the production of COF to a new level.
Reference: Baidu Encyclopedia-COF, Baidu Encyclopedia-COF Index