I. Infrared laser (wavelength 1064nm)
1. Thin-film solar P1 layer etching
2. Laser marking
3. Cutting, scribing
4. Thermal-sensitive printing
5. Fully-automated laser resonance
6. Scientific research and so on
Two green laser (wavelength 532nm)
1. Thin film solar energy etching
2. Silicon wafer scribing
3. Glass, ceramics marking
4. Cutting, scribing
5. Microvia processing
6. PCB drilling
Three, ultraviolet laser (wavelength 355nm)
1. Thin film solar energy etching
1. Etching
2. Silicon wafer scribing
3. Glass, ceramics, plastics marking
4. Cutting, scribing
5. Microvia processing
6. FPC cutting I. Picosecond laser cutting equipment Soft Sweeper
1. Processing capacity: 19pcs / h @ 10 × 23mil (monthly capacity) More than 10,000 pieces)
2. Brightness after cutting is 5~10% higher than traditional laser scribing (brightness after packaging)
3. Processing yield is better than the sidewall etching process by 3~5%, and the consistency of the chip performance is very good
4. 1064nm wavelength laser source is standard, and it can cut the backward DBR chip directly
5. It can cut the chip under 200μm thickness in a single step directly. 200μm thickness of the chip below
Two, LED wafer UV laser high-speed scribing equipment Ultra Scriber
1. unique V-shaped cut, can help your chip to easily achieve satisfactory brightness enhancement
2. fast speed, high capacity
3. 4-inch platform as standard, leaving plenty of room for upgrading
4.Automatic image recognition and positioning system, so that the identification and positioning of a key to complete
Three, the guide plate Laser Dot Pattern System Ink Printing Dot Laser Dotting Efficiency 2min/pc (a line) 5-10min/pc (55") Consumables Ink, water, electricity, gas, stencils, acid Electricity Supporting equipment Transmission line and oven and other equipment None Design cycle Long (stencil production time is long) Short Manpower Multiple people 1~2 people Operational Complexity Simple Scrap rate High (ink is easy to fall off) Low Plant occupancy 200 square meters/per line 4 square meters/per equipment Processing quality (brightness) General Higher IV. ITO Laser Etching Equipment ITO Laser Etching System Laser DPSS 1064nm/355nm working width 400mm × 500mm (can be customized) Processing speed Straight line 1000mm/s (max), curve 3000mm/s (max) Processing line width 10~50μm Comprehensive processing accuracy ±15μm Scope of application Resistive Touch Screen, Capacitive Touch Screen V. Glass Laser Engraving System Laser Engraving System Laser DPSS 355nm/532nm working width 400mm×500mm (can be customized) Processing speed Straight line 2~5mm/s (ASAHI), circle 1s@t=1mm, φ1mm (ASAHI) Processing glass thickness 0.3~4mm Processing accuracy Positional accuracy <±20μm, chipping Control<100μm Glass type Calcium soda-lime glass, quartz glass, etc. Six, Ag Laser Etching System Silver Laser Etching System Processing width 400mm × 500mm (can be customized) Processing line width 20~40μm Processing line distance ≥ 30μm Processing speed Straight line 1000mm / s, curve 3000mm / s Seven, glass laser scribing machine Glass Laser Scribing System identification and positioning CCD automatic identification and positioning of the processing object related to the maximum work size of 650 × 550nm, glass thickness of 0.33 ~ 1.1mm VIII, fiber laser fine processing equipment
1. can be processed stainless steel, alloys and other materials
2. can be processed alumina, aluminum nitride and other ceramic materials
2. Ceramic materials
3. High-speed linear cutting of ceramics
4. Battery electrode sheet cutting
5. Drilling and cutting of thin metal parts