In refrigeration chip during the work, as long as the temperature difference between the hot and cold side, heat will continue to pass through the lattice, the heat will be moved to the hot side and through the heat dissipation equipment to disseminate out.
The semiconductor refrigeration chip is considered to be a heat transfer tool, although the refrigeration chip will actively dissipate heat for the chip, to the hot end of the higher than the chip's heat dissipation. While the cooling element is an active cooling device for the chip, it is an active heat transfer device for the entire system. The ZENO96 SmartCooler, which employs a semiconductor cooling device, still has to take an active cooling approach to cool down the hot side of the cooling element.
Structure:
The semiconductor thermocouple consists of a N-type semiconductor and a P-type semiconductor. the N-type material has an excess of electrons, there is a negative temperature potential. the P-type material is electronically insufficient, there is a positive temperature potential; when electrons from the P-type through the junction to the N-type, the junction's temperature decreases, and the energy is bound to increase and increase in energy equal to the junction of the energy consumed. Conversely, when electrons flow from the N-type to the P-type material, the temperature of the junction increases.
Reference to the above; Baidu Encyclopedia-Cooling Chip