Edit this paragraph SMT has any characteristics:
High assembly density, small size and light weight of electronic products, the volume and weight of SMD components is only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products is reduced by 40% to 60%, the weight is reduced by 60% to 80%.
High reliability and vibration resistance. Low solder joint defect rate.
Good high frequency characteristics. Reduced electromagnetic and RF interference.
Easy to automate and improve productivity. Reduce cost up to 30%~50%. Save material, energy, equipment, labor, time, etc. Computerized Mounter, as shown
Edit Why SMT:
The pursuit of miniaturization of electronic products, previously used perforated plug-in components can not be scaled down
Electronic products are more complete, the integrated circuits (ICs) used have no perforated components, especially large-scale, high-integration ICs, and have to use the surface-mounted components
The product Batch production, production automation, the factory to low-cost high-yield, high-quality products to meet customer demand and strengthen market competitiveness
The development of electronic components, integrated circuits (IC) development, semiconductor materials, multiple applications
The revolution in electronic technology is inevitable, chasing the international trend
Editorial section of the SMT basic process components:
Silkscreen (or dispensing) --> Mounting --> (curing) --> Reflow soldering --> Cleaning --> Detection --> Rework
Silkscreen: The role of the solder paste or patch adhesive leakage printed to the PCB pads for the welding of the components to prepare. The equipment used for screen printing machine (screen printing machine), located in the forefront of the SMT production line.
Dispensing: it is the glue drops to the fixed position of the PCB, its main role is to fix the components to the PCB board. The equipment used is a dispenser, which is located at the very front of the SMT production line or at the back of the testing equipment
.
Mounting: its role is to accurately install the surface assembly components to the fixed position of the PCB. The equipment used is the SMD machine, which is located at the back of the screen printing machine in the SMT production line.
Curing: its role is to melt the patch adhesive, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing oven, located in the SMT production line in the back of the mounter.
Reflow soldering: its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow oven, located in the SMT production line behind the mounter.
Cleaning: Its role is to assemble the PCB board above the harmful welding residues such as flux removed. The equipment used is a cleaning machine, the location can not be fixed, can be online, or not online.
Detection: its role is to assemble a good PCB board for welding quality and assembly quality testing. The equipment used is a magnifying glass, microscope, online tester (ICT), flying pin tester, automatic optical inspection
(AOI), X-RAY detection system, function tester and so on. The location can be configured in the appropriate place of the production line according to the needs of the inspection.
Rework: its role is to detect the failure of the PCB board rework. The tools used for the soldering iron, rework workstations and so on. Configured in any position in the production line.