SMT production process:
1, programmed to adjust the mounter
According to the sample provided by the customer BOM patch location map, the coordinates of the location of the patch components to do the program. Then with the customer provided by the SMT chip processing information on the first piece.
2, printing solder paste
The solder paste with stencil leakage printing to the PCB board need to weld electronic components SMD pads, for the welding of components to prepare. The equipment used for screen printing machine (printing machine), located in the forefront of the SMT chip processing line.
3, SPI
Solder Paste Tester, testing solder paste printing is good, there is no less tin, tin leakage, more tin and other bad phenomena.
4, SMD
Electronic components SMD accurately mounted to a fixed position on the PCB. The equipment used for the SMD machine, located in the SMT production line behind the screen printing machine.
5, high-temperature solder paste melting
The main solder paste through high temperature melting, cooling so that the electronic components SMD and PCB board firmly welded together, the equipment used for the reflow soldering furnace, located in the SMT production line in the back of the SMD machine.
7, visual inspection
Manual testing and inspection of the focus of the project: the version of the PCBA is the version of the change; whether the customer requires components to use the substitute material or specify the brand, brand components; IC, diodes, transistors, tantalum capacitors, aluminum capacitors, switches, and other directional components with the direction of the direction of the correct; defects in the weld: short-circuit, open-circuit, fake parts, false soldering.
8, packaging
The products that have passed the test are separated and packed. Generally used packaging materials for anti-static bubble bags, electrostatic cotton, blister disk. There are two main packaging methods, one is to use anti-static bubble wrap or electrostatic cotton into a roll, separated from the packaging, is currently the most commonly used packaging methods; the second is in accordance with the size of the PCBA custom blister disk. Placed in the blister tray to swing open the packaging, mainly on the needle more sensitive, there are fragile patch components of the PCBA board.