Low-pressure injection molding (low-pressure injection) molding process is a very small injection pressure (0 ~ 6MPa) will be injected into the mold encapsulation material and rapid curing molding (5 ~ 50 seconds) encapsulation process methods to achieve insulation, temperature resistance, impact resistance, vibration damping, moisture resistance, waterproof, dust, chemical corrosion resistance and other efficacies, at present, Germany's chemical giant Henkel can be provided with high-performance technology for this process, Macromelt series hot melt adhesive as the encapsulation material, with Dongguan Tensai to provide low-pressure injection machine and mold as tools. Macromelt series hot melt adhesive as encapsulation material, with Dongguan Tian Sai provides low pressure injection molding machine and mold as a tool. It is mainly used for the encapsulation and protection of precise and sensitive electronic components. Its application areas are very wide, including: printed circuit boards (PCB), automotive electronics, automotive wiring harnesses, automotive connectors, sensors, microswitches and so on.
The advantages of this low-pressure injection molding technology are embodied in the following: enhancement of the performance of the end product; a significant reduction in the development costs of new products, shorten the product development cycle, while it can significantly improve production efficiency; total production cost savings.