The rapid rise of domestic chips, Intel and other old giants panic?
If we talk about the popular industry in recent years, I believe that the rapid development of the field of domestic semiconductor chips must be a topic that can not be avoided. Can see, not only the purple light show sharp, Longxin Zhongke, Datang Telecom and other veteran chip research and development enterprises to do more and more prosperous, and even news pointed out that the Longxin Zhongke company has been in a wide range of attraction of financing, seeking to go public. At the same time, cell phone terminal manufacturers, including Huawei, millet, vivo, OPPO, etc., also accelerated the layout of self-developed chip technology.
First of all, the famous Huawei Haisi Semiconductor, with years of technological innovation and R & D accumulation, Huawei Haisi self-developed Kirin chip has long benefited hundreds of millions of terminal consumers around the world. Borrowing Huawei managing director Yu Chengdong recently said in public that due to some well-known factors, Huawei's 5G chip can only be used as a 4G, but Huawei has never stopped the chip self-research footsteps.
And Xiaomi also in the following five years ago for the first time will be self-research Surge SoC equipped with its own terminal products after the continuous force, in recent years has brought the millet Surge P1 fast charging chip and Surge G1 battery management chip, recently released Xiaomi 12S Ultra at the same time equipped with these two Xiaomi self-research chip. The OPPO and Vivo have developed their own Vivo V1 image chip and OPPO Marianas X chip, which can effectively improve the imaging quality in the actual shooting process.
There are specialties in the industry, and the industry's declining threshold has prompted related companies to enter the game.
As we all know, most of the previous chip companies were IDM-type companies, such as Intel, Texas Instruments, and so on, and they had to design the chip, manufacture the chip, and test the chip, and then get it done by themselves, without having to beg for help from anyone else.
But later, the IDM model was subdivided, according to the process is divided into three blocks, respectively, design, manufacturing, packaging and testing. A lot of companies only focus on one of them, and no longer get everything done on their own. This actually inadvertently lowered the threshold of the chip industry, the manufacturers only need to focus on one of the links can be. At the same time, this is also conducive to the industry to do fine, because more focused on a link, more able to excel, as the so-called industry specialization.
Therefore, when the industry has been subdivided in this way, the enterprises that began to develop chips are more and more, and in various fields have emerged as the top enterprises, whether it is a cell phone SoC chip, 5G chip, or today's hot car chip, self-driving chip and so on are so.
I believe we are more curious, for our domestic chip R & D manufacturers, packaging, design and manufacturing of the three areas of the overall level in the end how? At the same time and in which segment is more prominent?
When it comes to design, we have to mention Huawei Haisi, which we know very well. Up to now, Hesi has independently designed and developed a number of chip products, including Kirin chips, Kunpeng chips, as well as power management chips, NPU chips, 5G chips, and so on, and the world's leading. And, in terms of ARM chips and RISC-V chips, the overall level of domestic chip makers is not weak.
The gap between domestic chips and international giants still exists, but it's narrowing
As we mentioned earlier, Chinese mainland chip companies like Longchamp are now growing at a fast pace, catching up with Intel, AMD, and other industry "big brothers".
These are the first time I've seen a chip in the market.
So, at this stage, how much of a gap is there between Longchip's technology and product level and the international head manufacturers? Catching up with Intel and others is a luxury, or possible, let's take a look.
Last month, Longchamp officially released the 3C5000 series of chips, which utilizes Longchamp's self-developed LoonArch instruction set architecture. According to the official statement, the 3C5000 series can meet the needs of general-purpose computing, large-scale data centers, and cloud computing centers.
Official data shows that the 3C5000 adopts a 16-core design, with a unixbench score of more than 95,000, and a double-precision computing capability of up to 560GFlops, which is comparable to the peak performance of a typical ARM 64-core processor.
In addition, the 3C5000 series supports up to 16-way interconnect, and with the introduction of the Lon Chip 7A2000 bridge chip, the PCIe bandwidth is upgraded by more than 400% compared to the previous generation of chips. From the description, 3C5000 series does have good performance, so how about the specific performance?
In terms of specific parameters, the 3C5000L has a main frequency of 2.0GHz-2.2GHz, supports four 72-bit DDR4-3200 controllers, supports ECC checksums, 1 SPI, 1 UART, 3 I2C, 16 GPIO interfaces, and a power consumption of 130W.
It can be seen that although this Longchip 3C5000L but from the literal parameter does not look particularly colorful, but in the current stage of the domestic self-developed processor is already one of the existence of the speed of its progress is also much faster than expected. In addition, LoongArch has also been freed from the shackles of MIPS, and according to the relevant information, LoongArch is a new type of architecture that is completely self-developed by our country, and is only compatible with MIPS through the binary translation technology.
Writing in the end
In other words, the major constraints on the domestic chip today are only the processor and the processor, but also the processor and the processor.
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