1. Quality test content including surface finish, silkscreen is clear, whether the pad is rounded and welded in the center of the pad, the method is to use the photographic negative manufactured by the negative covered in the processed printed circuit board, the determination of the edge of the printed circuit board dimensions, the width of the conductor and the shape of the requirements within the scope.
2. Pad weldability is an important indicator of the printed circuit board, the main measurement of solder on the printed pad wetting ability, divided into wetting, semi-wetting and non-wetting three indicators.
3. Electrical performance test mainly includes FPC flexible board insulation and connectivity, connectivity can be measured by the optical board tester. Insulation test is mainly measured insulation resistance, circuit board manufacturers can choose two or more closely spaced wires, the first measurement of insulation resistance, and then humidified and heated for a certain period of time and return to room temperature and measured again.