Global Chip Midstream Related Enterprises Summary Overview
Chip Design:
Samsung, Intel, Qualcomm, Broadcom, Toshiba, ST, Apple, Micron, Nvidia, NXP, Infineon, RDA, SK Hynix, Western Digital, Texas Instruments, Hesse, Mega Innovation, Huitian Technology, Huada Semiconductor, Datang Telecom, Nationwide, and Zhongxing Microelectronics, Beijing Junzheng.
Chip Manufacturing:
Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor Corporation (HHSC), TSMC, Samsung, Intel, Triple A Optoelectronics Corporation (SAOC), Shanghai Advanced Technology Corporation (SATC), Shanghai SAMC, TowerJazz, SK Hynix, Glorfonda, UMC, Lijiang Technology, Vanguard, Hua Hong Hong Hong Li (HAHL), Fujitsu, Yangtze River Memory Technology (XRAM), China Resources Semiconductor (CRST), and Huali Microelectronics.
Global chip midstream related companies summary overview
Silicon wafer manufacturers:
Japan's Shin-Etsu, Japan's Katsushika, Global Wafers, Germany's Siltron, LGsiltron, Soitec, Hop Chip, Okmetic, Taiwan's Ka-ching, Shanghai Xinyi, Chongqing Super Silicon, Ningxia Yinhe, Zhonghuan, Jinrui Lie, and so on.
Silicon Park Foundry:
TSMC TSMC, Glorfonda, UMC WC, SMIC SnIC, Powerchip Poverchip.Toverjazz, World Advanced vls, Huahong Semiconductor, Eastern High-Tech, X-Fab, and so on.
Packaging and testing:
Changdian Technology, Huatian Technology, Tongfu Microelectronics, Crystal Square Technology, Taiji Industry, Dagang Stocks, Deep Technology, Huanxu Electronics, Taiwan Sunrise, U.S.A. Amkor, South Korea Nenes, Unisen, Taiwan Lixing Technology, Gansu Tianshui Huatian, Qipai Technology.
Photoresist:
Wisdom buds R & D Intelligence Library explains photoresist as follows:
Photoresist, also known as photoresist, by the photoresist resin, sensitizer (see spectral enhancement of infectious materials) and solvent of the three main components of the composition of the light-sensitive mixed liquid. From the Wisdom Sprout R&D Intelligence Library, learn about related technology points and solution paths.
Industry Overview
Upstream of the semiconductor industry chain:Upstream are the raw materials and equipment needed to manufacture semiconductors.
Midstream/downstream of the industry chain: The midstream is the process of manufacturing semiconductors, which mainly includes integrated circuit (IC) design, IC manufacturing and packaging and testing. Downstream is the application including industrial control, automotive electronics and so on.
Domestic semiconductor industry chain
Semiconductor upstream raw materials in the silicon wafer on behalf of the upstream: enterprises are: Central shares, Shanghai silicon industry, such as Jiangfeng Electronics
Photoresist enterprises are Jingrui shares, Dow Chemical, Kewa Microelectronics, Asahi into chemical and so on. Encapsulation materials such as DowDuPont Hongchang Electronics.
Semiconductor design companies on behalf of ZTE Micro midstream: electronics, ZiGuang State Micro, Haisi, etc.; semiconductor manufacturing companies on behalf of, SMIC, China Resources Microelectronics, Lianhua Electronics, etc..
Downstream semiconductor applications include: network communications, consumer electronics, automotive electronics and industrial manufacturing and other fields.
Design and testing
1)Design:
There are two main types of companies, IC design (integrated circuit design) and IDM (vertically integrated manufacturing), the former is involved in the architecture and design of chips and integrated circuits, while the latter takes into account the design and manufacturing steps.
Representative companies are:NVIDIA, NXP Semiconductors, Intel and domestic Hesse, SMIC and so on.
2) Sealing and testing:
Sealing and testing refers to the lead bonding, flip-flop and other technologies to connect the chip with external circuits, which is an indispensable downstream link in the semiconductor value chain, and is labor-intensive, and is usually accomplished by the outsourced semiconductor packaging and testing industry (OSAT).
Representative companies are:Sun Micron Group, Amkor Technology, Changdian Technology and so on.
Semiconductor value chain
The semiconductor value chain mainly consists of: design, manufacturing and packaging.
The upstream companies are responsible for the production of equipment, raw materials and EDA software required for semiconductor design and manufacturing. These devices are widely used in the manufacture of integrated circuits (ICs), optoelectronic devices, discrete devices, sensors and other fields.
Semiconductor-related collation
1)Memory chips:Including NAND (flash memory chips) and DRAM (memory), the former is used in SSDs and cell phones, and the latter is used in PCs, and the major vendors of these two types of chips have achieved mass production.
2)Analog chips:Widely used in consumer electronics, automotive and industrial electronics.
3)CPU (center processor).CPU is one of the main accessories of electronic computers, commonly used in servers and PCs.
4)GPU (display chip). Including graphic display GPU and computing GPU.
5)AI/ML ASIC.Mainly used in servers, divided into AI practice and AI reasoning.