Why buy SPI solder paste tester equipment? From Fudie Details?0?3

Development, the detection of smt products technology is also constantly updated, from the human magnifying glass or microscope manual visual inspection to a variety of testing equipment endless, but with the smt mounted zero device precision is getting higher and higher volume is getting smaller and smaller-0603; 0402 or even smaller, the human ability to visually inspect has been far from enough, and the Aoi automatic optical inspection equipment is more up-to-date and become more efficient! More amazing efficiency! Therefore, with the development of the PCBA industry, the stronger the function, the smaller the volume, Aoi will increasingly show its important position! With the help of AOI, and then human visual inspection, 0402 components below the visual inspection can not be done, you can use AOI inspection, and then visual inspection of false alarms. AOI + ICT can be used, of course, is good, just small components of the circuit board, ICT has no place to put the needle. Of course, do not rely entirely on inspection, to count the faults, to find ways to improve the process, less defects is the fundamental way! With the powerful SPC function, the real realization of measurement data and product lines, stencils and printing parameters associated with automatic judgment, automatic production reports! SPI imported to bring the benefits of 3D solder paste inspection equipment in the line (SPI) 1) According to statistics, the introduction of SPI can be the original finished PCB failure rate effectively reduced by more than 85%; rework, scrap cost significantly reduced by more than 90%, the quality of the factory products significantly improved. SPI and AOI joint use, through the SMT production line real-time feedback and optimization, can make the production quality more stable, significantly shorten the introduction of new products must go through the unstable trial production phase, the corresponding cost loss is more economical. 3) can significantly reduce the AOI on the solder misjudgment rate, thereby improving the through rate, and effectively save human error correction of human labor and time costs. 4) SPI can be used in the production of PCBs and PCBs, and can be used in the production of PCBs and PCBs. 5) SPI can be used in the production of PCBs and PCBs, and can be used in the production of PCBs and PCBs. According to statistics, 74% of the current finished PCB unqualified and solder has a direct relationship, 13% have an indirect relationship. SPI through the 3D detection means to effectively make up for the shortcomings of the traditional detection methods. 2) Some PCB components such as BGA, CSP, PLCC chips, etc., due to their own characteristics of the light brought about by the blockage of the patch reflow AOI can not be detected after their detection. SPI can minimize the defective situation of these devices after oven through process control.3) Along with the trend of increasing precision and lead-free soldering of electronic products, the SMD components are getting more and more miniature, therefore, the quality of solder paste printing is becoming more and more important.SPI can effectively ensure good quality of solder paste printing, and greatly reduce the possible defective rate of the finished product.4) As a means of quality process control, it is able to 4) As a means of quality process control, quality hazards can be detected in a timely manner before reflow soldering, thus virtually eliminating rework costs and scrap possibilities, and effectively saving costs.