ST's sales revenues are evenly distributed among the semiconductor industry's seventh fastest-growing market (five major markets as a percentage of 2007 sales revenues): Communications (35%), Consumer (17%), Computing (16%), Automotive (16%) and Industrial (16%). According to the latest industry statistics, STMicroelectronics is the world's fifth largest semiconductor manufacturer and a world leader in many markets. For example, STMicroelectronics is the world's No. 1 manufacturer of dedicated analog and power conversion chips, the world's No. 1 supplier of industrial semiconductors and set-top box chips, and a world leader in discrete devices, cell phone camera modules and automotive integrated circuits.
Product portfolioAiming to be the market leader in multimedia suite integration and power solutions, ST has one of the strongest product portfolios in the world, ranging from specialized products with a high intellectual property content to innovative products in multiple fields, such as discrete devices, high-performance microcontrollers, secure smartcard chips, and microelectromechanical systems (MEMS) devices.
ST has been a pioneer in developing complex ICs using a platform-based design approach in demanding suites such as mobile multimedia, set-top boxes and computer peripherals, and continues to improve on this design approach. ST has a well-balanced portfolio of products to meet the needs of all microelectronics users. ST is the preferred partner for System-on-Chip (SoC) projects for strategic customers worldwide, and the company also supports local companies in all aspects of meeting the needs of their local customers for general-purpose devices and solutions.
STMicroelectronics has announced a joint venture with Intel and Francisco Partners to create an independent semiconductor company called Numonyx, which will focus on providing non-volatile memory solutions for consumer electronics and industrial equipment.
R&D ManufacturingSince its founding, ST has never wavered in its investment in R&D and is recognized as one of the most innovative companies in the semiconductor industry. Manufacturing processes include advanced CMOS logic (including embedded memory derivatives), mixed-signal, analog and power manufacturing processes. In the advanced CMOS area, ST will work with the IBM alliance to develop next-generation manufacturing processes, including 32nm and 22nm CMOS process development, design realization techniques and advanced research for 300mm wafer fabrication, in addition to utilizing ST and IBM's 300mm production facility in Crolles, France, to develop high-value-added CMOS-derived system-on-chip (SoC) technology using 300mm production facilities in Crolles, France.
STMicroelectronics has a large global manufacturing network of front- and back-end wafer manufacturing (front-end refers to wafer fabrication, and back-end refers to assembly, packaging, and test). The company is transitioning to a lighter capital-intensive manufacturing strategy, and recently announced a shutdown plan to close some of its older fabs. Currently, ST's main wafer fabrication facilities are located in Agrate Brianza and Catania in Italy; Crolles, Rousset and Tours in France; Phoenix and Carrollton in the United States; and Singapore. Highly efficient packaging and testing facilities in China, Malaysia, Malta, Morocco, and Singapore provide strong back-end process security for these advanced fabs.
Cross-border alliancesST has developed a global network of strategic alliances, including product development with major customers, technology development with customers and semiconductor vendors, and equipment and CAD tools with key suppliers. In addition, ST conducts a variety of research programs with leading universities and prestigious research institutes around the world to promote industrial R&D activities through academic research. ST is also involved in European advanced technology research programs such as MEDEA+ and industrial programs such as ENIAC (European Nanotechnology Initiative Advisory Council).
Principles of ExcellenceST was one of the first international semiconductor companies in the world to recognize the importance of environmental responsibility, starting its corporate environmental responsibility initiatives as early as the 1990s, and since then has made impressive progress on environmental issues, for example reducing energy consumption per production unit by 47% and CO2 emissions by 61% between 1994 and 2006. In addition, ST is well ahead of existing regulations and has almost completely eliminated hazardous substances such as lead, cadmium and mercury from its manufacturing processes. Since 1991, the regional companies have been honored with more than 100 awards for excellence in corporate responsibility in the areas of quality, corporate governance, social issues and environmental protection.
Basic InformationSTMicroelectronics (ST) was founded in 1987 as a new company following the merger of SGS Semiconductors of Italy and Thomson Semiconductors of France, and has grown faster than the semiconductor industry as a whole from its inception to the present. Since 1999, ST has consistently been one of the top ten semiconductor companies in the world.
The entire group*** employs nearly 50,000 people in 16 state-of-the-art research and development facilities, 39 design and arbitration centers, 15 major manufacturing facilities, and 78 sales offices in 36 countries.
The company is headquartered in Geneva, Switzerland, and also serves as the headquarters for the European region as well as emerging markets; the company's U.S. headquarters is located in Carrollton, Dallas, Texas; Asia Pacific is headquartered in Singapore; Japanese operations are headquartered in Tokyo; and Greater China is headquartered in Shanghai, with responsibility for the three regions of Hong Kong, mainland China, and Taiwan.
Since completing its initial public offering on December 8, 1994, STMicroelectronics has been listed on the New York Stock Exchange (ticker symbol: STM), the Euronext Paris Stock Exchange and, in June 1998, on the Milan Stock Exchange in Italy. STMicroelectronics has nearly 900 million publicly traded shares, of which approximately 71.1% are publicly traded on various stock exchanges. Another 27.5% of the shares are held by STMicroelectronics Holding II B.V. Limited, whose shareholders are the Italian Finmeanica consortium formed by Finmeanica and CDP, and the French consortium formed by Areva and France Telecom; the remaining 1.4% of the treasury shares are held by STMicroelectronics.
Product rangeST has one of the broadest semiconductor product lines in the industry, with more than 3,000 major product types, from discrete diodes and transistors to complex system-on-chip (SoC) devices to complete platform solutions including reference designs, suite of software, manufacturing tools and specifications. STMicroelectronics is a leading supplier to a wide range of industries, with a broad portfolio of advanced technologies, intellectual property (IP) resources and world-class manufacturing processes.
Semiconductor products can be broadly categorized into two groups: specialized products and standard products. Specialized products integrate a large amount of proprietary IP from semiconductor manufacturers as well as users and third parties, which differentiates them from other products in the market, such as:
System-on-Chip (SoC) products
Customized and semi-custom circuits
Specialized Standard Products (ASSPs) such as wireless processor packages, set-top-box wafers, and automotive ICs
Microcontrollers
Smart card ICs
Specialized memory
Specialized discrete devices (ASDs?)
Once a customer has used a specialized product in an application, it is often not possible to replace the product without modifying the hard- and soft-ware design.
In contrast, standard products are devices that implement a specific, commonly used function, and these devices are typically offered by several vendors. Typically, a manufacturer introduces a standard product that can be replaced by a similar product from another manufacturer, with the difference between suppliers being primarily in cost and customer service. However, once the design is frozen, the standard device becomes the only device in terms of performance optimization.
Standard products include:
Discretes such as transistors, diodes, and thyristors
Power transistors such as MOSFETs, Bipolar, and IGBTs
Analog circuit building blocks such as operational amplifiers, comparators, voltage regulators, and voltage reference circuits
Standard logic functions and interfaces
Numerous memory products such as standard logic functions and interfaces
Numerous memory products such as standard or serial NOR flash memory, NAND flash memory, EPROM/EEPROM and non-volatile RAM
RF discrete devices and ICs
Since its inception, ST has successfully balanced its market development with the integration of differentiated and specialized products, which are often less susceptible to market cycles, and traditional products, which are more cost-effective than traditional products. Since its inception, ST has successfully balanced market development by combining differentiated, specialized products, which are often less susceptible to market cycles, with traditional standard products, which require less R&D investment and less capital-intensive production. ST's diversified product portfolio avoids over-reliance on generic or specialized products.
Specialized products System-on-ChipThe most complex of the specialized product families are SoC devices, which integrate complete systems on a single chip. In many cases, this means integration of the entire suite, meaning that the device incorporates all electronic circuitry except for components that do not need to be integrated, such as memory, passive components, and displays. However, often integrating the entire system on a single chip is not the most cost-effective solution, so the term SoC is also used to refer to chips that integrate the majority of the system.
SoC technology expands the semiconductor industry's ability to consistently increase the number of transistors on a given wafer. However, it also involves many other factors, including system knowledge, software technology, architectural innovation, design, verification, debugging, and test methods. As semiconductor devices become more prevalent in electronic equipment and their significant impact on device performance, price, and development time, device manufacturers are becoming increasingly dependent on semiconductor suppliers for complete platform solutions. Today, semiconductor suppliers can provide customers with complete solutions, including customized reference designs, complete software packages (containing the underlying driver software, embedded operating systems, and middleware and application software).
Many SoC products can be manufactured using only CMOS technology, but complete SoC manufacturing technology requires the ability to integrate basic technologies such as COMS, bipolar, non-volatile memories, power DMOS, and micro-electro-mechanical systems (MEMS) into a system-oriented technology (which integrates two or more basic technologies). ST has been a global leader in the development and adoption of these system-oriented technologies for many years.
SoC devices typically incorporate one or more processor cores, and ST offers customers the broadest range of processor cores in the world, including 32-bit high-performance ARM-based and PowerPC-based products, primarily for wireless and automotive applications. ST's open approach to processor core technology is designed to provide customers with the most appropriate processor core, whether proprietary, co-developed or licensed by a third party.
Customized wafersCustom and semi-custom ICs are both designed for special users, but they are designed and manufactured differently. A semi-custom wafer is a general-purpose wafer that contains a series of circuit cells that can be interconnected in a variety of ways to achieve the desired functionality. Custom wafers, on the other hand, are designed from scratch. Some customers prefer to design their own wafers (especially those containing valuable IP) and contract manufacture them with a wafer manufacturer based on criteria such as cost, capacity allocation, and prior business relationships. Other customers prefer to enter into agreements with wafer suppliers for both design and manufacturing, so there is a series of intermediate relationships.
STMicroelectronics offers a range of custom and semi-custom services that leverage world-class manufacturing machinery, unparalleled semiconductor process technology, a broad and deep IP portfolio, and leading-edge design methodologies. These success stories are the use of complex wafers to drive large-scale projects such as the XM digital satellite radio service in the United States and leading-edge solutions for strategic partners across all segments of the electronics industry.
Standard ProductsASSPs (Application Specific Standard Products) are integrated circuits designed for use in specialized applications. Examples include digital set-top box chips, CMOS imaging ICs, motor control circuits and wireless application processors. Unlike custom ICs designed for single-user special applications, ASSPs are designed for special applications common to many users. Many ASSPs are developed in close cooperation with special customers, even though the corresponding devices may be available on the open market. By working with customers in this way, ST is able to ensure that the products and technologies it develops are well matched to the changing needs of industry.
ST's product portfolio includes multiple types of ASSPs optimized for key growth business suites in wireless communications and networking, digital consumer, computer peripherals, automotive, industrial and smart cards. By providing chipsets with complete reference platforms, recognized software packages and development kits, the company enables its users to quickly and cost-effectively develop and differentiate their products.
ST's ASSPs, ranging from mobile imaging to multimedia processing to power management and handheld and network connectivity suites, address a broad range of telecom suite requirements. The company offers components for a wide range of digital consumer applications, with a particular focus on set-top boxes, digital TVs and digital cameras.
In the field of computer peripherals, ST focuses on power management and power supplies for data storage, printing, visual displays, and PC motherboards. A wide range of ST's ASSP power/complex digital automotive systems, such as engine control, automotive safety equipment, door modules and in-vehicle infotainment systems. The company also offers industrial ICs for factory automation systems, wafers for lighting and battery charging, or power supply devices and wafers for advanced smart card suites.
MicrocontrollersST's microcontrollers offer a wide range of suites, from those that require the lowest cost of ownership in the first place, to those that require strong real-time performance and high-level language support. ST's comprehensive product portfolio includes powerful 8-bit general-purpose flash memory microcontrollers with standard communication interfaces such as USB, CAN, LIN, UART, I2C, and SPI; dedicated 8-bit microcontrollers for brushless motor control, low-noise block converters (LNBs), smart card readers, USB flash memory drivers, and programmable system memory (PSM). PSM (Programmable System Memory), which integrates memory, microcontroller and programmable logic unit on a single chip; 16-bit industrial standard devices and flash memory controllers based on high-performance 32-bit ARM cores with excellent low-power characteristics and advanced communication peripherals (including Ethernet, USB and CAN).
ST's specialized microcontroller solutions help accelerate the development of emerging low-data-rate wireless networks such as real-time location systems (RTLS) and Zigbee platforms for remote monitoring and control.
Security ICsSTMicroelectronics offers a complete range of security microcontrollers and memories for smart card and proxy applications, together with a broad portfolio of high-speed, co-locatable system-on-chip (SoC) solutions. The products are used in all types of smart card applications, from the simplest phone cards to the most demanding SIM and Pay-TV cards. Security has always been an area of expertise for ST, as evidenced by several formal security certifications, standardized memberships, and the successful implementation of ST's secure IC products in many areas, including banking, IT security, electronic ***, public **** transportation and mobile communications.
MemoryWhile many memory products are standard, ST has developed a wide range of specialized EEPROMs and flash memories that leverage ST's strengths in non-volatile memory technology and its strong relationships with leading users. Working with leading OEMs, ST has developed innovative products optimized for specific applications such as cell phones, automotive engine controls, PC BIOS, set-top boxes and hard disk drives.
DiscretesASD products are based on vertical or horizontal bipolar architectures implemented at the top and bottom of the wafer die. ASD technology enables ST to bring to market a wide range of products that can handle large bi-directional currents, maintain high voltages, and integrate a variety of discrete components in a single die. ASD technology is an ideal solution for general purpose protection components, ESD protection devices, EMI filters, and AC switches with built-in overvoltage protection. With recent process upgrades, ASD technology allows for the integration of multiple discrete and passive components (such as resistors, capacitors, and inductors) on a single chip, resulting in the IPAD family (Integrated Passive and Active Devices).The main areas of application for ASDs are in wireless and fixed line communications, home appliances, PCs, and peripherals.
Standard Products MemoryST offers the industry's broadest range of memory solutions for leading applications. ST is a leading supplier of non-volatile memory, including NOR and NAND flash memory.
Flash memories combine high density with electrical erasability. They are commonly used in a variety of digital applications such as cell phones, digital cameras, digital TVs, set-top boxes, car engine controls, etc., which require programmability in the system and need to retain data even when power is not available.
As one of the world's top three suppliers of NOR flash memory, ST offers two main types of flash memory: NOR and NAND. The NOR flash memory architecture provides fast read performance and is ideal for code storage and direct on-chip execution in cell phones and other electronic devices. However, for high-density data storage, the higher density and programming throughput of NAND flash memory makes it the preferred choice.
ST's family of non-volatile memories also includes EPROMs (Erasable Programmable Read Only Memory), EEPROMs (Electrically Erasable Programmable Read Only Memory), Serial Flash Memories and Random Access Memory (RAM).
Other ST's memory products include a wide range of RFID ICs, and as with all standard devices, cost and customer service are the main differences between vendors, and ST is making every effort to optimize both.
For applications that require both fast code reading and high-density sockets, such as today's multifunctional cell phones, ST also offers advanced multi-chip solutions that combine different types of memory in a single wafer package.
Intelligent PowerST's power devices meet the growing demand for power solutions that integrate signal processing components (analog and/or digital) and electric actuators. This design capability not only provides unique economic advantages, but also offers improvements in stability, electromagnetic performance, and reduced airborne noise and weight. Intelligent power as a term of art encompasses a wide range of horizontal and vertical technologies that play a critical role in the automotive market in particular.
VIPower (Vertical Intelligent Power Supply) is an umbrella term for a wide range of proprietary intelligent power supply technologies where discrete power supply structures now combine analog and digital control and diagnostic currents, allowing the device to combine the power of discrete technology with the control and diagnostic capabilities of current. ST's BCD (Bipolar-CMOS-DMOS) production technology combines bipolar, CMOS and DMOS processes, allowing the integration of more and more essential system functions such as voltage regulators, communication interfaces and multi-load drivers in a single component.
Standard DevicesST's standard linear devices and logic ICs consist of a wide range of well-known standard devices and specialized devices for highly integrated, space-constrained suites of innovations. The product range includes logic functions, interfaces, operational amplifiers, comparators, low-power audio amplifiers, communication circuits (high-speed analog, infrared and RF), power management devices, voltage regulators and reference circuits, microprocessor resets and monitors, analog and digital switches, power switches, VFD drivers and high-brightness LED drivers.
DiscreteST is one of the world's leading suppliers of discrete power devices, including MOSFETs (including those utilizing the innovative MDmeshTM second generation technology), bipolar transistors, IGBTs, Schottky and ultra-fast-recovery bipolar process diodes, three-terminal bi-directional silicon-controlled switches and protection devices. In addition, ST's patented IPAD (Integrated Passive and Active Devices) technology allows the integration of multiple active and passive components in a single chip
RFST's RF products include power RF transistors that can be used in ISM (Industrial Scientific and Medical), cellular base stations and other applications.
Real Time ClocksSTMicroelectronics offers a complete line of low-power real-time clocks (RTCs), from input-level products to high-end RTCs with microprocessor monitoring, SRAM, non-volatile features, and general-purpose reduced-detection pipelining for advanced data protection. Embedded software calibrates to an accuracy of only 2 seconds per month.
AwardsOn May 13, 2020, ST was ranked #822 on the 2020 Forbes Global 2000 list.
ST AlliancesStrategic Alliances and Industry Collaborations
Since its birth, ST has been a pioneer in the creation of strategic alliances and is recognized for developing relationships with users, suppliers, competitors, universities, research institutes and European research programs. Strategic alliances and industry collaboration are becoming increasingly important for success in the semiconductor industry.
STMicroelectronics has formed strategic alliances with customers including Alcatel, Bosch, Hewlett-Packard, Marelli, Nokia, Nortel, Pioneer, Seagate, Siemens VDO, Thomson and Western Digital. Western Digital, among others, have formed several strategic alliances. The user alliances provide ST with valuable systems and application expertise and access to major product markets, while enabling its users to share the risk of product development and to have access to ST's process technology and production facilities. ST is now actively leveraging its extensive experience and technology to expand the number of user alliances for top OEMs in the US, Europe and Asia.
While continuing to compete for sales, partnering with other semiconductor industry manufacturers allows ST to increase its investment in costly research and development and manufacturing resources for the mutual benefit of technology development.
STMicroelectronics has been a consistent winner in the wireless technology space, partnering with Texas Instruments in 2002 to develop and promote an open standard for a wireless suite of processor interfaces. This innovation has now spread to more companies and is known as the MIPI Alliance (founding members are ST, ARM, Nokia and Texas Instruments). The consortium now has over 92 members, collaborating to become leaders in the mobile industry with the goal of developing and promoting open standards for the mobile suite of processor interfaces.
Non-volatile memory is a strategic product division of STMicroelectronics. In this area, ST has been working with Hynix for four years to jointly develop NAND Flash technology and products. As for NOR Flash, it has formed a strategic alliance with Intel on product targets for wireless sets. And, it recently signed an agreement with Freescale to jointly develop microcontrollers with embedded Flash (manufactured using 90nm technology).
STMicroelectronics also has joint development programs with leading suppliers such as Air Liquide, Applied Materials, ASM Lithography, Axalto, Canon, Hewlett-Packard, KLA-Tencor, LAM Research, MEMC, Teradyne and Wacker, as well as leading electronic design automation (EDA) tool manufacturers including Cadence, CoWare and Synopsys.
In terms of joint R&D programs, ST also participates in European collaborative research programs such as MEDEA+ (a pan-European program for advanced collaborative R&D in microelectronics and its applications) and ITEA2 (a strategic pan-European program for advanced pre-competitive R&D in Europe for the development of information technology, software-intensive systems and services). ST also plays a leading role in the recently created European technology platforms - ENIAC (European Nanoelectronics Initiative Advisory Committee, which provides strategic research directions in nanoelectronics) and ARTEMIS (Advanced Research and Technology for Embedded Intelligence and Systems, which plays a similar role to that of embedded systems). Furthermore, ST also collaborates with numerous universities around the world, including those in Europe, the United States and China, as well as major research organizations such as CEA-Leti and IMEC.
As for manufacturing, in 1998 ST opened its back-end assembly and test facility in Shenzhen, China. The plant was in the nature of a joint venture between STMicroelectronics and Shenzhen Haidake Industrial Company Limited (SHIC) **** In 2004, STMicroelectronics signed and published a joint venture agreement with Hynix to establish a front-end memory manufacturing facility in Wuxi, China. The joint venture is an extension of the inter-company NAND Flash process/product co-development relationship, with a 200-mm wafer production line to be put into production at the end of 2006 and a 300-mm wafer production line to be put into production in 2007.
ST University University Profile
With management and field training needs as the benchmark, ST University develops and deploys strategic, enterprise-wide training programs.
ST University works closely with ST's various training organizations to deliver training program curricula that are designed to meet ST's and ST University's evolving training needs.
There is only one training program in the ST University training catalog that is geared toward both ST employees and external engineers. The primary objective of this technical program is to develop technical expertise in the area of microelectronics manufacturing management.
This unique program is a collaboration between STMicroelectronics and 2 renowned French engineering schools - "L'Ecole Nationale Supérieure des Mines" de Saint-Etienne and "l'Ecole Centrale" Marseille. It provides technical and managerial skills to engineers who play a key role in today's demanding microelectronics industry. In order to keep pace with the leading technologies in the microelectronics industry, ST University improves the entire program every year with the support of industry experts, academics and researchers.ST University develops and improves the relationship between the theoretical curriculum and the suite of applications, as well as the participation of ST industry experts and ST suppliers.
CurriculumThe program is divided into 2 main parts:
Part 1: Focuses on the fundamentals and nested courses in the following 3 areas:
Devices and Technologies: Physical characterization tools and manufacturing process steps.
Development of integrated circuits: design tools, testing, and back-end operations.
Manufacturing and Management Tools: Manufacturing equipment management, manufacturing techniques, reliability and quality systems.
Part 2:A 6-month internship in a company (mainly in ST) focusing on specific subjects related to the project.
China JointSTMicroelectronics (ST) and China First Automobile Company Limited (FAW, FAW) announced a collaboration in the field of automotive electronics technology, as well as the establishment of the FAW-STMicroelectronics Joint Laboratory for Automotive Electronics at the FAW Technology Center. The joint lab will be oriented towards advanced automotive electronics technology solutions, with R&D covering powertrain, chassis, safety systems, bodywork, automotive infotainment systems, and new energy technologies. FAW will introduce ST's microcontrollers (MCUs), Application Specific Standard Products (ASSPs) and intelligent driver chips within its advanced automotive electronics R&D platform.
The main R&D direction of the joint lab is the advanced automotive electronics suite. Leveraging ST's automotive electronics R&D experience, technology strengths, products (such as ST's PowerPC family of 32-bit microcontrollers and highly integrated chips for engine management systems), prototyping, and technical support, the Joint Lab will drive collaborative R&D in automotive electronics technologies, such as ECUs (Engine Control Units), TCUs (Transmission Control Units), and EPSs (These R&D results will enhance the market competitiveness of FAW's next-generation vehicles.
Li Jun, Deputy Chief Engineer and Director of Technology Center of FAW Group, said: "China's auto sales volume has ranked the first in the world for three consecutive years, and as consumers pay more and more attention to auto safety and comfort, the auto electronics market is also growing at a high speed, and China is a huge market for automotive semiconductors. The establishment of a joint laboratory between FAW and STMicroelectronics will help promote in-depth cooperation between the two parties, enhance the core competitiveness of FAW's automotive electronics, and promote the independent innovation capability of automotive electronic products."
Edoardo Merli, Marketing and Application Manager, Automotive Products Division, Greater China and South Asia, STMicroelectronics, said, "We are very pleased to be able to work with FAW, a leading automotive OEM in China. As the No. 1[1] automotive IC supplier in China and No. 3[2] globally in 2011, STMicroelectronics has great strengths in powertrain, body, safety, infotainment and in-vehicle multimedia, strengths that are recognized by China's automakers. We believe that the partnership will also strengthen ST's leading position in China's automotive electronics industry."