The Dual In-line Package (DIP) is one of the most popular plug-in packages. DIP is one of the most common type of package, the use of standard logic voice IC, memory LSI, microcomputer circuits, etc. The pin center distance is 2.54mm, and the pin center distance is 2.54mm, and the pin center distance is 2.54mm. The pin center distance is 2.54mm, the number of pins is from 6 to 64, and the width of the package is generally 15.2mm, and some packages with widths of 7.52mm and 10.16mm are called skinny DIP and slim DIP (narrow DIP) respectively. However, in most cases, there is no distinction, but simply collectively referred to as DIP. In addition, the ceramic DIP sealed with low melting point glass is also known as cerdip (see cerdip).
SOP (Small 0ut-line Package)
Small Outer Plate Package. One of the common component package, from the pin in-line package developed, the primary use of the appearance of the mounted components. Its advantage is to reduce the difficulty of PCB circuit board design, and it also greatly reduces its own scale. Pin center distance of 1.27mm, the number of pins from 8 to 44. Other, pin center distance of less than 1.27mm SOP is also known as SSOP; mounting height of less than 1.27mm SOP is also known as TSOP (see SSOP, TSOP). There is also a SOP with a heat sink.