1. Before entering the clean room, you must inform the administrator and pass the basic training.
2. It is strictly prohibited to enter the clean room to smoke, eat (drink), foreign debris (such as newspapers, magazines, pencils ...) can not be brought in. (such as newspapers, magazines, pencils, etc.) can not be brought into the room, and is strictly prohibited from running and gathering to talk about the day.
3. Before entering the clean room, you need to take off your shoes in the specified place, put your shoes in the shoe locker, put your coat in the closet, put your personal belongings in the private locker, and do not put food in the locker.
4. To enter the clean room, you need to be in the locker room first, put on the mask, dust-free hat, dust-free clothes and shoe covers in accordance with the regulations and procedures, and then wash the dust in the air wash room, and step on the dust carpet (on the floor of the clean room) before you can enter.
5. When wearing a mask, the mask should be worn on top of the nose to cover the mouth and nose holes as a principle, so as not to contaminate the chip when breathing.
6. You should organize your clothes and hair before wearing the dust-free clothes and dust-free hat, so that you don't feel uncomfortable after putting on the dust-free clothes and not organizing them.
7. After combing the appearance, the first to wear a dust cap, dust cap wearing principles:
(1) hair must be completely covered in the cap, not exposed.
(2) dust cap under the pendulum to be flat scattered over the shoulders, wearing a work shirt, so as not to get out of the lower, bare shoulders and neck.
8. After the dust cap is properly worn, then the dust coat, dust coat should be appropriate size, so that there will not be pants or sleeves too short and bare skin of the risk of wearing clothes should pay attention to the cap under the pendulum should be to keep the state of flatness, dust coat can not be worn backwards.
9. After putting on the dustless clothes, then take the shoe cover, pull on the shoe cover and make the shoe cover flat, and cover the pants above.
10. When wearing gloves, you should avoid touching the palm and fingertips of the gloves with your bare hands (to prevent sodium ion contamination), and after wearing gloves, you should place the wrist of the gloves inside the sleeve to isolate the source of contamination.
11. After the dustless clothes are properly dressed, the dust is washed and the dust blanket is stepped on before entering the clean room.
12. Whether you enter or leave the clean room, you must take off the dust-free clothes in the changing room according to the regulations, not in other areas, especially not in the clean room while walking.
13. Clean clothes, shoe covers, etc., should be cleaned regularly, and should be replaced when they are damaged or out of line.
14. When you take off the clean clothes, the order is the opposite of wearing.
15. The clean clothes should be hanged and put in the upper locker in the locker room; the shoe covers should be placed under the hanged clean clothes.
16. In the locker room, no other items are allowed to be placed in the locker room except for the required items such as clean clothes.
17. Except for the prescribed papers and articles, no other articles are allowed to be brought into the clean room.
18. Dustless clothes should not be taken out of the clean room and should be placed in the specified place after use.
19. Masks and gloves can be stored or reused depending on the situation.
20. Anything that enters the clean room must be wiped clean with sprinkles.
21. Please notify the manager of any equipment entering the clean room, and wipe it clean outside the clean room before entering.
22. The use of instruments that have not passed the test is prohibited. In case of an emergency, we must follow the steps of emergency treatment, such as shutting off the switch of water, electricity, gas, etc.
23.
23. No fire is allowed in the clean room to avoid accidents.
The clean room operation instructions
1. When dealing with the chip, you must wear non-fiber gloves, use clean tweezers to hold the chip, do not touch the chip with your fingers or anything else, the chip contaminated by the touch must be cleaned before it can continue to be used:
(1) Any tweezers front (i.e., the end of the chip) if it is touched or the tweezers fall to the ground, it must be taken to clean. (i.e., the end that holds the chip) if any of the front of the tweezers has been touched, or the tweezers fell to the ground, must be taken to clean Do not wipe the dirty tweezers with paper towels or cloth.
(2) If the chip is touched by a finger after cleaning and before proceeding to the next program, it must be cleaned again.
(3) Place the chip on the quartz boat, ready to enter the furnace tube, if you find that the tweezers used in the phenomenon of contamination or the chip is conspicuous by the tweezers caused by the contamination, you must re-clean the chip, and immediately replace the clean tweezers to use.
2. The chip must be placed in the box, covered and stored in the specified location, as far as possible not to expose it.
3. Avoid talking on the chip to prevent saliva from splashing on the chip. Before the chip is put into the diffusion oven, please pay special attention to prevent the above action from generating, if the chip is stained with fiber shavings, use a nitrogen gun to spray it.
4. From the Teflon (Teflon) boat, quartz boat (QuartzBoat) and other carriers (Carrier), remove the chip, must be vertically upward hold up to avoid scratching the chip, the microscope lens has been away from the chip, before removing the chip from the suction base.
5. On the chip, if there is a long oxide layer, do not use a diamond knife to mark the chip before sending it to the yellow light room.
6. Never put your hands in the cleaning water tank when operating, with or without gloves.
7. When using a chemical station or oven to process the chip, always place the chip in a Teflon boat, not a plastic box.
8. When placing the chip in the quartz boat, if the chip falls on the floor or in your hand, you must re-clean the chip before putting it in the oxidizer.
9. Do not touch the inside of the box, if touched or contaminated with broken chips, it must be re-cleaned.
10. Gloves, waste paper and other debris should not be left on the operating table. Gloves must be replaced if they are burnt, worn out, or if the fiber quality becomes too much.
11. Unless instructed, never open the unfamiliar instruments and all kinds of switch valve control knob or handle.
12. Strange taste or reaction abnormal solution, color, sound, etc. Please notify the relevant personnel.
13. If there is any damage to the instrument due to incorrect operation, please inform the person in charge or the teacher immediately.
14. Chip boxes must be kept clean and wrapped in plastic wrap when entering or leaving the clean room.
15. In the clean room, we use ballpoint pens and dust-free notebooks to make records, and general paper and pencils are not allowed to be brought in.
Three, yellow light area operating instructions
1. Humidity and temperature will affect the alignment work, in the yellow light area should pay attention to the temperature and humidity, and should reduce the alignment machine near the people, in order to reduce the humidity, temperature changes.
2. On the proper photoresist has not been exposed to the completion of the chip, shall not be carried out of the yellow light area to avoid light sensitivity.
3. Chipsets that have been photoresisted and are waiting to be aligned for exposure should be placed in an opaque blue-black box with a lid that is properly covered.
4. The photomask should be used with the edge of the photomask, not touching the photomask surface, and the chromium film of the photomask should not be in contact with other objects under any condition to prevent scratching, and the dust of the photomask can be blown by the nitrogen gas gun.
5. Avoid looking directly into the mercury lamp of the exposure machine during exposure.
4. Tweezers
1. When you enter the lab, you should put on gloves before taking the tweezers in order to avoid contamination.
2. Only clean tweezers can be used to hold the chip. Once the tweezers fall on the ground or are touched by the hand, or are contaminated for other reasons, they must be cleaned before they are used again.
3. Tweezers should be placed in the specified place in each station after use, and should not be placed arbitrarily. If there are tweezers for special process, they should be kept by themselves after use, and should not be mixed with tweezers in each station in the lab.
4. The tweezers should be held in a "pencil grip" position to hold the chip.
5. When taking the chip, the order should be from back to front, and when putting the chip back, it should be from front to back to avoid scratching the surface of the chip.
6. When holding the chip, the "short side" (saw-like head) is placed on the front side of the chip, and the "long side" (flat head) is placed on the back side of the chip, and the blank part of the chip is held, so as not to hurt the chip.
7. It is strictly prohibited to put the tweezers in contact with the acid bath or D.I Water bath.
8. Tweezers can only be used to hold the chip, and are not allowed to be used for other purposes.
5. Chemicals
1. The entry and exit of chemicals must be registered and the administrator must be notified, and the MSDS must be attached at the entrance of the laboratory.
2. Before using chemicals, please read the Material Safety Data Sheet (MSDS) and inform the administrator.
3. Before changing the acid, you must wear an acid-proof plastic skirt, acid-proof long-sleeved gloves, glasses, and plastic acid-proof shoes before changing the acid.
4. Do not arbitrarily open the lid of the acid bottle, lock the lid immediately after use.
5. When diluting the acid, always remember to add acid to water, never add water to acid.
6. Do not taste any chemicals or use your sense of smell to determine what is in the container.
7. Do not shake or invert the container if you do not know what kind of medicine is in it.
8. All chemical work must be done in a well-ventilated or exhausted area.
9. When working with acids, read the operating instructions.
10. Acids can be stored with alkalis*** in the same cabinet with ventilation, but never with organic solvents.
11. Waste acid should be put into the waste acid barrel, and should not be dumped arbitrarily, not to mention mixing with organic solutions.
12. Waste organic solution should be put into the organic waste liquid barrel, and should not be dumped or poured into the waste acid barrel arbitrarily.
13. Do not change the solution in the container arbitrarily.
14. If you want to bring in the solution by yourself, please inform us in advance and get permission before you bring it in. If the solution you want to bring in is dangerous, it must be evaluated before you bring it in, and please clearly mark the contents of the container and the retention period on the container.
15. Waste liquid treatment: Waste liquid is divided into acid, alkali, hydrofluoric acid, organic, etc., which are handled separately and registered, and the recycling bucket is clearly labeled, and the waste liquid bucket contains hydrofluoric acid and other acids and alkalis, which should not be touched by hand.
16. Handling of water or acid leakage: In case of water or acid leakage, in order to ensure the safety, you should not touch it with your hands, and close the main switch of power supply and the related valves, and then handle it with dust-free cloth or acid/alkali adsorbent, and report it to the administrator.
6. Chemical workstation operation
1. Rubber gloves and masks are required for operation.
2. Do not put the plastic box into the acid tank or cleaning tank.
3. Before adding any solution, be sure to check the solvent in the container before adding.
4. When working in the chemical workstation, you should develop a good working posture and avoid leaning forward over the chemical tank and cleaning tank to prevent danger on one hand and reduce the chance of contamination on the other.
5. When the chemical station is not in operation, the person with the cover should always keep the cover in place and turn off the water switch of the cleaning sink.
6. When chemicals splashed on clothes, skin, face, eyes, should be immediately flushed with water to splash the injured parts for more than 15 minutes, and the skin color must return to normal, and immediately arrange for first aid treatment.
7. In case of chemical leakage, we should react quickly and do proper treatment, and if there is a need to evacuate, we should evacuate according to the instructions.
8. Rubber gloves are used on all chemical workstations to avoid touching the machines and workstations, and other appliances, etc. Please wear dust-free gloves for general operation.
VII. RCA Method
1. DIWater 5min
2. H2SO4:H2O2=3:1 Boil for 10~20min at 75~85℃ to remove metal, organic and oil
3. DIWater 5min
4. HF:H2O 10~30sec to remove natural oxidized layer (Native Oxide). Native Oxide
5. DIWater 5min
6. NH4OH:H2O2;H2O=1:1:5 Boil for 10~20min 75~85℃ to remove metal and organic
7. DIWater 5min
8. HCl:H2O2:H2O=1:1:6 Boil for 10~30sec to remove metal and organic
8. HCl:H2O2:H2O=1:1:6 Boil for 10~10sec to remove metal and organic
9. 1:1:6 Boil 10~20min 75~85 ℃ Deionization
9. DIWater 5min
10. Spin Dry
VIII. Cleaning Precautions
1. If there is water, then water is poured first, and H2O2 is poured last, and the numerical ratio is volume ratio.
2. Organic and acid and alkali should never be mixed, and the operating platform must be used separately.
3. Pour the acid and alkali solution into the recycling tank after cooling, and flush the glass with DI Water for 5 min.
4. Wash the empty acid and alkali bottles with water and place them in the outdoor recycling canisters according to the plastic bottles and glass bottles.
5. Hydrofluoric acid can corrode bones, if encountered, immediately apply calcium gluconate with water, then rinse with water and seek medical attention. If you come across any other acid or alkali, immediately flush with DI Water.
6. Put the cleaned Wafer in DI Water to avoid contamination.
7. Simple cleaning step is 1-2-9-10; SiO2 cleaning step is 1-2-10; Al cleaning step is HCl:H2O=1:1.
8. Positive photoresist removal step is 1-2-10, or immersed in ACE with ultrasonic oscillation.
9. Each glass or tank has a specific solution to be filled, etching, cleaning, plating, organic should never be mixed.
10. Waste liquid recycling is divided into five types: acid, alkali, hydrofluoric acid, electroplating and organic, which are recycled separately and recorded, and the waste compatibility table is checked before dumping to make sure that there is no error before dumping.
Clean room system
Using operation method
1. Firstly, open the switch of electric heat operation, pressurized windmill operation, dust bath room operation and exhaust windmill operation on the controller panel.
Note:
＊The temperature controller and humidity controller can be adjusted by the yellow knob, generally the temperature control is 20℃ DB and the humidity control is 50% RH.
＊The voltage switch on the left side of the controller panel is RU, and the current switch is T. On the right side of the controller panel, the voltage switch is RS, and the current switch is OFF.
2. >
2. Turn on the air supply switch of the box air conditioner, wait for the air supply to stabilize and then turn on the cooling and heating switch, at this time, the red light will be on, indicating normal operation.
Note:
＊ The starting sequence of cold air is compressor NO.2.
＊ Temperature adjustment is pointer pointing to the red warm air 5.
＊ The shunt switch AIR VALVE is ON.
3. After the clean room is finished using, you should close the box air conditioner first, and then press the stop button.
4. Then turn off the switches on the controller panel for electric heat operation, pressurized fan operation, dust bath room operation, exhaust fan operation, etc. in order.
GAS CYLINDER
Use operation method
1. Open the gas cylinder counterclockwise to the end with the handle, and close the OUTLET open PURGE.
2. Adjust the pressure (psi) of the gas cylinder by the black rotary knob, clockwise for increase and counterclockwise for decrease.
3. Adjust the N2 cylinder to 40psi (20psi in the yellow room) and the AIR cylinder to 80psi (60psi in the yellow room).
4. After the gas cylinder is used, use the handle to close the gas cylinder clockwise to the end, turn the OUTLET off and PURGE on to discharge the gas in the line and then turn the PURGE off.
Pure water system
Use of operating methods
1. Valve control
(1) Valve (VALVE) V1, V2, V3, V4, V6, V8, V10, V12, V13, V14, V16, V17, V19 should be kept fully open.
(2) Valves V5, V7, V11, V18, V21 should remain fully closed.
(3) Valves V9, V20 are for pressure regulation and should not be fully open or fully closed.
(4) Valve V5 is the BY-PASS of sand filter, V15 is the BY-PASS of U.V lamp, V18 is the BY-PASS of DI bucket, V21 is the BY-PASS of RO membrane.
2. Automatic water making
Step 1: Position the ball valves on/off as above valve control.
Step 2: On the control box, each toggle switch is kept in OFF position.
Step 3: On the control box, the system operation switch is switched to the ON position.
Step 4: Solenoid valve 1 is activated for initial discharge.
Step 5: Solenoid valve 2 activate to make water.
Step 6: At this time, PUMP1, PUMP2 activated in sequence, the system normal water, RO water through the pipeline into the water storage tank (TANK), when the water is full of control box on the high level indicator light, the system automatically shut down, and the water level of the storage tank to the low level and then activate the water.
3. System water
Switch the night cycle on the control box - stop - water switch to water, at this time the PUMP3 transfer pump is activated, the TANK of pure water through the pump to the U.V., DI barrels and precision filtration for the use of the site of the use of the point.
4. Night cycle
The night cycle - stop - water switch on the control box is mainly in line with the daily off or continuous holiday stop the water supply pipeline sanitation considerations, the steps are:
(1) stop the water supply for 59 minutes, the system automatically water supply for another 1 minute.
(2) Thereafter, every 59 minutes the water supply cycle for 1 minute until the night cycle stops.
5. System Detection
The system is equipped with various pressure gauges, flow meters and conductivity meters as the control of the system operation, the functions are as follows:
Pressure gauge 1: sand filter inlet pressure
Pressure gauge 2: RO inlet pressure
Pressure gauge 3: RO drainage pressure
Pressure gauge 4: DI inlet pressure.
Pressure gauge 5: water supply return pressure
Flowmeter 1: RO drainage flow rate
Flowmeter 2: RO water flow rate
Additionally, the control box (room) with a two-segment LED conductivity display, raw water and produced water are switched to display.
6. System maintenance
HF-RD system, should be regularly updated consumables:
(1) sand filter should be regularly reversed.
(2) Pre-filter should be renewed every 1-2 months.
(3) Membrane tubes should be cleaned or renewed as necessary depending on the removal rate and water yield.
(4) The resin mixed bed should be updated according to the specific resistance value.
(5) Precision filtration should be updated every 2-4 months.
7. Troubleshooting
Phenomenon Possible Factors Remedy
System shutdown, system inactivation 1. external power supply abnormality 2. system operation switch is not pressed 3. system circuit malfunction 4. motor/pump malfunction 1. check the system power supply circuit 2. press the system operation switch 3. notify the manufacturer 4. update the motor/pump
Low water production 1. Membrane drain too high 2. Insufficient pressure 3. Membrane clogged 1. Adjust drain valve V92. Clean or renew membrane
Low Specific Resistance 1. Decrease in resin function 2. Decrease in RO removal rate 1. Replace resin 2. Replace RO Membrane Set
Photomask Aligner
Using the machine
Exposure machine introduction
In semiconductor manufacturing process, the coating photoresist is used for the production of the photoresist, which is used in the production of the semiconductor. In the semiconductor process, after coating photoresist, the chip has to be exposed to UV light to develop, this exposure machine is OAI200 series, integrating photomask alignment, UV light exposure development, UV light measurement device and photomask clamping device.
The OAI200 series is an entry-level photomask aligner that can be manually operated to change various parameters, such as exposure time, exposure intensity, and exposure power. The OAI200 series is an entry-level photomask aligner that can be manually operated to change various parameters, such as exposure time, exposure intensity, and exposure power, etc. It has a very good effect on the development of medium and high line widths, and can be used with up to a four-inch chip with a maximum exposure power of 1KW.
Steps for Using the Exposure Machine
1. Check the nitrogen cylinders 〈AIR 60psi〉, 〈N220psi〉, and the nitrogen valves of the yellow room, and the air valves, to see if the air valves are open. Turn on the red master switch of the extension cable below the exposure machine, and then turn on the exposure machine and microscope.
2. Connect the power supply of the tunnel-type air extraction motor, carry out the steps of air extraction of the exposure machine, and check whether the air inlet behind the mercury lamp holder on the top of the exposure machine has air intake. If there is little or no air inlet, the power to the mercury lamp will not be turned on (an alarm will sound). Make sure there is air in the air inlet before turning on the mercury lamp power supply ON/OFF switch below the exposure machine.
3. Press and hold the START button of the mercury lamp power supply for about 1~3 seconds, at this time, the current value will rise 〈representing the mercury lamp is lit, and start to consume the current〉, and then release the button immediately, and the mercury lamp will be lit.
4. After the mercury lamp is lit, at least 30 minutes of standby time is required to stabilize the Lightsource system. If the mercury lamp does not light up, do not perform any maintenance.
5. After the system is stabilized, fill in the voltage and current values of the power supply into the record table, and every time you turn on the lamp, it should be registered as a record.
6. Unscrew the screws of the light cover fixture, the front of the light cover (chrome-plated surface) facing down, aligned with the three datums, press the MASKVAC key, so that the vacuum suction light cover, and then lock the screws to fix the light cover.
Note:
＊ MASK Holder must be lowered to place the mask.
＊ Blow the mask and MASK Holder with nitrogen first, with the mask facing down, aligned with the black iron frame, keep your hands away from the mask, depress the MASKVAC. key to make the vacuum suck the mask, and lock the two black iron edges next to it.
＊ Check whether the round base CHUNK where the chip is placed is lower than the photomask to prevent the photomask from crushing the chip.
7. Toggle the MASK FRAME UP/DOWN key to make the MASKHolder rise, place the chip on the CHUNK, toggle the SUB VAC. key to ON to make the vacuum suck the chip, and toggle the MASK FRAMEUP/DOWN key to make the MASK Holder drop.
8. Trigger the Table Edge Knob (Ball LockButton) to Unlock, slowly rotate the Rotary Knob (Z knob) in clockwise direction so that the Chip Base rises up until the Drive Belt feels like it has been pulled taut, then rotate the ZKnob counterclockwise for about 15 frames and trigger the Table Edge Knob (Ball Lock Button) to Lock.
Note:
This is the first time that the MASK Holder has been used in a vacuum system, so that the MASK Holder will be put down. >Note:
＊ Z knob is about 15 microns per frame.
＊ Turning the Zknob counterclockwise will cause the chip base to drop down, the purpose of which is to align the chip with the mask, so that the chip and the mask do not rub against each other directly.
＊ If alignment is not necessary, you can rotate the Z knob without using the counterclockwise direction.
＊ When rotating the Zknob, no matter clockwise or counterclockwise, when the belt slips, it means that the chip base is already in contact with the mask, and you should not rotate it counterclockwise, which could result in the internal bolts coming loose.
＊ CHUNK ¨ Z ¨ ADJUST is generally between 15A~20 A, and the smaller the current, the looser the belt.
9. Move the microscope holder to the top of the photomask to align the chip with the photomask. If you need to adjust the position of the chip, you can use the fine-tuning lever next to the chip base to correct the X, Y and θ of the chip base.
10.
100 SEC
1000 SEC
RESET
EXPOSE
SEC
Left side of the exposer panel is as shown in the following figure:
Note:
The current is higher than the current. >Note:
＊There are two settings for the number of seconds of exposure, one is 1000SEC and the other is 100SEC; when 1000SEC is pressed, the counter can be set for a maximum of 999 seconds of exposure time; when 100SEC is pressed, the counter can be set for a maximum of 99.9 seconds of exposure time.
＊ Re-set the exposure seconds to measure the brightness of the mercury lamp, first press the LAMP TEST and then hold down the button on the handle to move the base to the bottom of the left end of the exposure machine, and then the OAI 306 UVPOWERMETER placed in the CHUNK can be, after the completion of the press RESET, and you can measure a few more different positions to see the brightness of the mercury lamp is uniform or not, the unit of measurement is mw/cm2, and the measurement is made in mw/cm2, and then the counter is set to 99.9 seconds. The measured unit is mw/cm2, multiplied by the time (SEC) that can be changed to the unit of mJ.
11. Set the exposure seconds, you can carry out the exposure program. Trigger CONTACT VAC. to ON and N2 PURGE to ON, then a slight vacuum will be generated between the chip and the photomask.
Note:
＊CONTACT VAC ADJUST is generally in the range of about red-25kpa.
12. Press and hold the button on the handle, then the base can be moved to the bottom of the left end of the exposure machine, release the button, then the exposure machine will automatically carry out the exposure action.
13. When exposure is complete, the base can be moved back to the right end of the exposure unit. The N2 PURGE trigger is OFF, and then the CONTACTVAC trigger is OFF, the instrument will be filled with nitrogen to break the vacuum between the photomask and the chip, making it easier for the user to take out the chip.
14. Rotate the Z knob counterclockwise and lower the chip base to the lowest point. Loosen the black edge iron frame fixed by the photomask, pull up the MASK VAC. knob to break the vacuum of MASKHolder, and the photomask can be taken out.
15. Trigger the MASK FRAME UP/DOWN to UP to raise the MASK Holder. Trigger SUBVAC. to OFF, use the Chip Clip to remove the chip, and trigger MASK FRAME UP/DOWN to DOWN again.
16. Repeat the above steps if you need to make another exposure.
17. After completing all exposure procedures, turn off the microscope light generator and then turn off the mercury lamp power supply. Wait for the exposure machine to cool down, and then finally turn off the wall nitrogen valve and air valve.
Thermal Vaporizer
How to use the machine
A. Turn on the machine
1. Turn on the main power switch on the back of the machine.
2. Turn on the cooling water, you need to activate the D.I Water system first.
3. Turn on the RP and warm up the machine for 2 minutes.
4. Turn on the 3-way valve to cut to the F.V position and wait 2 minutes.
5. Turn on the DP and warm up the machine for 30 minutes (the machine can be cleaned and loaded at the same time to save time).
B. Loading
1. Turn on the Vent and close it immediately after intake.
2. Open Chamber.
3. Loading Sample, Boat and Metal.
4. Blocking Sample with Shutter.
5. Closing Chamber. When closing the door, make sure the door is tightly closed, usually the top right corner of the door has to be pressed by hand due to the age of the machine.
C. Vacuum pumping
1. Initial pumping
(1) The three-way valve is cut to the R.V position (it is better to switch to F.V every few minutes, so as to avoid the oil and gas molecules in the DP from spreading into the chamber).
(2) Vacuum gauge VAP-5 shows to 5?10-2 torr when the three-way valve cut to F.V, wait 30 seconds.
2. Fine pumping
(1) M.V ON, record time.
(2) ION GAUGE ON, depress Fil to light filament (needs to be below 10-3 Torr or less for pumping to be complete).
D. Vapor Plating
1. At a pressure of about 2?10-5 Torr, start adding liquid nitrogen.
2. When the pressure is below 2?10-6 Torr, record the pressure and pumping time and turn off the ION GAUGE.
3. Heater Power ON (make sure the Power Adjustment Knob is zeroed).
4. Select BOAT1 or BOAT2.
5. Vaporization begins, note that the current should be increased slowly.
Note:
＊ When plating gold, the current on the meter is about 100A, when plating Al, the current can be slightly smaller, about 70~80A.
＊ When BOAT emits a red light from the high heat, the viewing window should be turned off immediately, so as to avoid the metal adhering to the glass of the viewing window.
＊ Air plating for a few seconds to clean the surface of the metal to be plated can be opened Shutter, start vaporizing.
＊ Immediately after the plating is completed, turn off the HeaterPower and wait 10~15 minutes for the BOAT to cool down and the metal to cool down after plating to avoid oxidization by contacting with the air immediately before venting to break the vacuum.
E. Vacuum Breaking
1. Substrate Hold temperature needs to be reduced to room temperature.
2. ION GAUGE POWEROFF.
3. M.V OFF.
4. DP OFF Cool down for 30~60 minutes.
5. Vent ON (immediately after intake).
6. Open Chamber, take out Sample and BOAT.
7. Close Chamber, take care to close the door tightly.
F. Shutdown
1. Turn off the F.V.
2. Turn on the R.V. and turn it off after pumping to 0.01 Torr.
3. Turn on the F.V. and cut the 3-way valve to the closed position after 30 seconds.
4. RP OFF.
5. Turn off the main power.
6. Turn off the cooling water.
7. Turn off the nitrogen.
Note:
＊ When vaporizing, the current should be increased slowly and should not be too big, so as not to vaporize a lot of metal in a moment, making the thickness not easy to control.
＊ If successive others to use, liquid nitrogen can be less filling a little, about one-third of the cylinder can be.
Oxidation Furnace Tube
Operating Methods
Oxidation Furnace Tube Introduction
The oxidation furnace tube used in this lab is the Lenton LTF1200 Horizontal Tubular Furnace, which can be used to put 2-inch silicon wafers, and the heating zone is larger than 50cm, with a maximum temperature of up to 1,200°C and can be used continuously for 24hrs, with a max. operating temperature of 1,150°C. The temperature control is based on PID. C, temperature control method using PID microcomputer automatic temperature controller.
Purpose
After exposing the silicon chip to a high temperature and oxygenated environment for a period of time, we can grow a layer of insulator-SiO2 on the surface of the silicon chip with good adhesion to the silicon, and the electrical properties in line with our requirements.
Attention:
＊Before turning on the oxidizing furnace, you must make sure that HEATSwitch is set to the O-off state. When power is supplied, the switch will light up and the oxidizer will start to heat up.
*If the over-temperature protection is good, make sure the alarm point is set appropriately for the current use. If the over-temperature protection is good, the buzzer will sound and there is a consistent program of alarms in the over-temperature control operation.
* In order to improve the collision of heat from the quartz glass tubes or bushings, the heating rate should not exceed a maximum of 3°C per minute.
* In order to minimize heat loss, proper operating procedures must be determined, and the quartz glass tubes can be sealed by the proper use of insulating pins and radiant shields.
＊ Do not shut down the oxidizer at maximum temperature when operating the oxidizer to extend the life of the oxidizer.
Operating Procedure:
1. Check the previous operation for any unusual problems and fill in the operation record.
2. Check the status of the machine
(1) Control panel status: Make sure HEATSwitch is set to O OFF before use.
(2) Heating control: Lenton LTF 1200 temperature >400°C, temperature difference between front and rear section of the furnace ?40°C.
(3) Gas control: H2OFF, O2 OFF.
3. Push the chip slowly into the furnace tube.
4. Turn on the H2 and O2 switches on the wall and the gas cylinder regulator in the machine room.
5. Set the preset gas (H2, O2) flow rate and furnace temperature.
6. Press the HEATSwitch to l, then the furnace temperature will be slowly heated from the constant temperature (400 ° C) to the standard process temperature of 1100 ° C, the maximum rate of increase can not be more than 3 ° C per minute.
7. Wait for the furnace temperature to drop to a constant temperature, and then take out the chip.
8. Turn off the H2, O2.
9. Turn off the H2 switch at the back of the furnace tube, the switch on the wall, and the gas cylinder regulator in the machine room.
10. Check that the stovepipe has completed its shutdown.
11. Fill in the operation record of the end time and abnormal protection and explanation.
Coater
Use operation method
1. First, insert the power plug of PUMP into the power outlet at the back of the coater.
2. Insert the coater's plug into a 110V power outlet and press the POWER button.
3. Set the rotation speed and time, this model is a two-stage accelerated Spin Coating, the right side is the first stage of acceleration, the left side is the second stage of acceleration.
4. According to different sizes of substrate, you can change different rotary dials to do the coating action.
5. Press the PUMP button, the rotary dial will suck the substrate, and then the photoresist will be coated from the center of the substrate to the proper amount in a spiral shape evenly and slowly.
6. Put on the protective cover of the coater to prevent the photoresist from spilling out of the coater.
7. Press the START button and the coater will start the coating action.
8. After coating, open the protective cover and press PUMP key to rotate the turntable to release the substrate, then you can take out the substrate.
Hot Air Circulation Oven
How to use
1. 110V/60HZ voltage is used in this machine.
2. After confirming the voltage, plug the power cord into the 110V socket.
3. Turn on the POWER switch, at this time the temperature meter PV that shows the actual temperature inside the box.
4. First press SET? The SV will keep blinking and you can start to set the temperature, and the caption window of SV will show high brightness, you can set the desired temperature in the high brightness position, just press the SET button again. The highlight will move with it, and the temperature can be set at the place of high brightness.
5. Pressing the UP key ▲ means the temperature is increasing upwards, and pressing the DOWN key ▼ means the temperature is decreasing downwards.
6. When you finish setting the temperature above (SV is still blinking), you just need to press the ENT key once and SV will show the temperature you just set (PV shows the actual temperature).
7. Heating lamp OUT display light indicates that the machine is heating up, and when it reaches the set point OUT will be a flash (normal phenomenon).
8. When the AT light is on, it means the temperature is being calculated automatically.
9. When ALM-1 red light is on, it means the temperature is too hot (the temperature will be cooled down automatically).
10. When the ALM-2 red light is on, the temperature is too low (the temperature will automatically warm up).
11. Temperature range:40℃~210℃.