In chip packaging, plasma cleaning can fundamentally improve the cleanliness of bonding pads before bonding. Plasma surface cleaning can obviously improve the shear strength of solder balls and the tensile strength of leads. The ideal result of tensile test is that the gold wire is broken, but it is still soldered on the pad. PVA TePla's unique microwave plasma can effectively remove a large number of organic pollution and poor oxide layers on bonding pads. Using our economical and effective microwave plasma process, the surface cleanliness can be controlled and the required effect can be achieved.
Oxen brand plasma cleaning machine equipment has been widely used in electronic circuits, electronic appliances, automobile manufacturing, semiconductor manufacturing, printing, coatings, polymer materials, medical devices, sterilization and other industries. At present, it has become the largest manufacturer of vacuum plasma processing equipment in China, covering a wide range of products.