I. Wire breakage: how to make prevent wire breakage; how to deal with the wire breakage (M&B. NTC HCT) to minimize the loss
II. Silicon wafer chipping. Line chipping point chipping chamfering chamfering
three. Uneven thickness: one corner is thin, uneven thickness
four. Line marks: dense line marks bright line marks
5. Flower stained piece: flower stained piece caused by degumming Flower stained piece caused by cleaning
In the field of solar photovoltaic, OLED, LED, TFT, LCD, photoelectric optics industry, chemical, electronics, electroplating, glass, etc., Dongguan Hengtian Water Treatment Equipment Co. has many years of solar photovoltaic,, OLED , LED, LCD, photoelectric optics industry, chemical, electronics, electroplating, glass and other industries. Demineralized water and ultrapure water equipment design, installation, commissioning and after-sales service success experience. Next I will do the above five key bad do from 5M1E6 aspects to do a detailed analysis of prevention and aftermath, etc. What are the specific parameters such as 0.10 steel wire requirements for the instantaneous breaking force how much? 1200 # 1500 # 2000 # Silicon Carbide particles roundness particle size requirements Viscosity tension requirements, etc. We go to the direction to find countermeasures to do the plan (P), do a good job of quantitative checklist (D), supervisor personally grasp the team leader to do the plan (D), and the director to do the work, and then the team leader to do the work. ), the supervisor personally grasp the team leader to supervise (C), summarize the results of the inspection to deal with the success of the experience to be affirmed and appropriate promotion, standardization; failure to sum up the lessons learned, so as to avoid recurrence, unresolved issues into the next PDCA cycle (A).
This is written M&B264 analysis of the causes, but from a standardized management point of view, it should still be of general significance Oh
Break the line of aftercare first to do a good job of breaking the line record (break the line of time, machine No., parts, cut depth) to stay in the line
1.
Identify the reasons for the breakage of the line and break the line of the situation.
2.
Report in time, without consent, no private treatment.
3.
Processing: 1. At the end of the line out of the broken line, the width of not more than 10 millimeters directly pull the line cutting.
2. Cutting depth ≦ 60mm in the middle or into the line end of the broken line to 30mm/min direct rise, rapid wiring, 8000 flow mortar flushing, rinsing pieces of dust-free paper on the line net,
rinsing off the pieces stuck together, quickly drop the bar to the distance from the line net at 2mm, and then
with 10mm/min feed carefully and meticulously "The middle or the end of the feed line breaks the line, the depth of cut between 50mm --- 80mm, with a speed of 10mm/min rise material to 30-40mm from the feed knife, stop. Line speed to 2m / s, to 2% of the line 1cm, to level the line network, stop. Open the mortar 8000 flow rate uniformly rinse sheet. The crystal rod on both sides of the wire net carefully cut off (cut with a hand pinch), leaving 3-4 cm of wire, the other end is not cut. (If there is a wire mesh at the inlet end, be sure to keep that part of the wire mesh for rewiring. When cutting both sides of the wire mesh must use hand or other clamping objects, clamp the reserved head of the wire mesh.) Wiring mesh, re-cutting.4 into the end or the middle of the broken line cutting depth of more than 80mm depending on the situation can recognize the knife on the recognition of the knife, or else on the reverse cut or directly pulling the line positive cutting.
4. into the line end of the broken line, the first broken line, the depth of cut in the 80mm.1 replace the release wheel, with an empty take-up wheel to replace. To lower than the original 2N (left 19 and right 21) tension, cutting line direction changed to: right, other parameters remain unchanged, manual 2m / s line speed go 1m, do not open the mortar. 2 to the bar lifted to 30 - 40mm, re-butt welding line, welding line to weld uniformly, weld the point of the point of the diameter of the same diameter as the wire. Walk 300--400 meters by 15N wire speed, change the tension to the tension of the automatic cutting, 1 meter per second, do not open the mortar, walk to the end of the 5 meters out of the wire, change the tension to 15N, wait for the head of the wire in the take-up wheel around 2--3 circles, change back to the original tension. Press the crystal bar to the broken line position error in 0.05mm, open the mortar. With 20% of 1m/s speed, walk up to 1m, confirmed by the shift supervisor after the error to cut.
5. by on the link must be dealt with in the line network (including, debris, glue, mortar particles) in the rise of the rod before the removal of the glue, rising speed of 10mm per minute, rising process, such as clamping line, can not be touched with your hands, can only be pressed with a slight manual probe to the line network to go flat.
6. Recognize the line before 5m / s speed of 100m, in the case of not loosening the tension, stop the line, and then 10mm / min to recognize the knife, to be recognized at once.
7. Reverse cutting settings to modify: feed down 1 percentage point, line speed by 1M/S, flow rate increased by 300KG/H.
8. thread numbering method: year + month + day + machine number + the first number of broken lines. For example:080501-20-01
9. Please ask the process inspector to do inspection according to this standard
Chipping problem Problems Problem point: Adhesive surface chipping
Abnormal phenomenon: After deglueing, the adhesive surface of the silicon wafer on both ends of the square bar shows edge shining,
Silicon layer is linearly falling off the edge of the chipping, and from the adhesive surface of the line chipping at 0.1mm. The chipping can not be observed when the adhesive is removed and cleaned
, but the chipping can be found during the inspection.
Cause analysis:
I. Unstable square feeding, unstable rotational speed of the external circular knife saw, knife saw diamond layer of poor quality, resulting in excessive knife marks, square bar surface knife pattern is not flat, bumpy and undulating, hidden damage (referring to the saw square) line square damage can be ignored
Two. Low temperature of the square rod, the high temperature reaction heat of the glue in the solidification, destroying the structure of the silicon layer on the adhesive surface
Three. Silicon wafer pre-rinse water temperature is lower than XX degrees, degumming water temperature is lower than XX degrees, the glue layer has not been completely softened when the staff will use their hands to force the silicon wafer for pouring.
Four. As a result of the use of small groove spacing and large diameter, it is inevitable to cause the tilt of the wafer to the side of the resistance is small, the resistance of the wafer at the two ends of the square rod is the most
smallest, resulting in two rods
sub four heads of the wafer within the length of nearly 32 millimeters of the wafer chipping.
v. The bonding agent was too hard (it is inconvenient to state the hardness factor), destroying the silicon layer at the moment the steel wire exited the adhesive surface of the silicon rods.
Preventive measures: i. Degumming, after the control of degumming specification operation, even if the previous process has been the surface of the bar to produce adverse effects, after optimizing the way of gluing and practices, but also to reduce the loss to a minimum. Under the premise of the current equipment configuration, strictly require degumming workers "45 ~ 50 degrees warm water, soak for 25 minutes"
Contact with the Ministry of Equipment, to do the wafer spacer, to reduce the tilt of the wafer when it falls.
II. Strictly control the water temperature of the ultrasonic pool of square rods at 40 degrees, the time interval from ultrasonic to gluing is controlled within 2 hours, and the temperature of the gluing room is controlled at 25 degrees, and the humidity is not more than 50%.
III. To square the machine for a feed and speed correction, square the square bar after the square by grinding and then rounding. And ask the equipment department to make a three-level maintenance plan for the equipment. Do regular maintenance
four. "Split-line network" wafer cutting: square rods at each end to leave 2mm not cutting, to reduce the cutting process of the wafer to both sides of the "fork"
Another way: to make a debuggable baffle system, blocking
square rods at both ends to prevent the wafer "fork". The silicon wafer "bifurcation" chipping.
Fifth, the use of line square and grinding machine, it is best to corrode the conditions. Replacement of adhesive strong but moderate hardness of the adhesive aftermath: frosted glass and 1700 # silicon carbide According to a certain proportion of water to choose a certain gesture, strength, angle grinding off the chipping edge within the edge length requirements (standard operating instructions)
Thickness and thinness of uneven 5m1e analysis of uneven thickness of the wafer preventive measures a. TV large or small: according to the customer's requirements of the thickness of the wafer, calculate the best cost / quality slot distance, steel line, the best cost / quality, the best cost / quality, the best cost / quality, the best cost / quality, the best cost / quality, the best cost / quality. quality of the slot distance, steel wire, silicon carbide, mortar density.
II.TTV" 15mm silicon wafers accounted for more than 0.62%, is abnormal. For a cutting unit, should increase the guide bar (parts not provided), two cutting unit is best to change the guide wheel (main roller) groove distance or the second cutting mortar flow increase of 500 kg / h (5l / min) or more than the replacement of 20 kg of mortar.
Three. Silicon wafer feed knife at the end of the feed line (corner) is thin or thick, should modify the slurry flow rate at the time of the feed knife
four: the same wafer thickness was large - small - large - small distribution, should be adjusted to the cutting process procedures. Feed, line speed, flow should be uniform and synchronized changes.
Fifth, jumper caused by a knife wafer thickness abnormality, the same piece of
thickness abnormality, the thickness of different pieces of deviation, etc., due to the addition of filters/filtering bags/oscillating filters and careful filtration prior to cutting, there is no jumper to eliminate