Laser as a new light source invented in the last century, it has good directionality, high brightness, monochromaticity and high energy density, etc., has been widely used in industrial production, communications, information processing, medical and health, military, culture and education, as well as scientific research and other aspects. According to statistics, from high-end fiber optics to common barcode scanners, the annual market value of laser-related products and services is up to trillions of dollars. China's laser products are mainly used in industrial processing, occupying more than 40% of the market space.
Laser processing, as the most commonly used application of laser systems, is a major technology that includes laser welding, laser cutting, surface modification, laser marking, laser drilling, micromachining and photochemical deposition, stereolithography, and laser etching.
Laser processing equipment is the use of laser processing technology to transform the traditional manufacturing industry, one of the key technical equipment, the main products include various types of laser marking machine, welding machine, cutting machine, scribing machine, engraving machine, heat treatment machine, three-dimensional molding machine, as well as the gross machine. These products have been or are entering the industrial sector.
Specific applications of laser processing technology:
Application in the apparel industry
Because the laser processing process has a high degree of automation, high processing accuracy, high speed, high efficiency, simple and convenient operation and other characteristics, adapted to the international trend of apparel production technology, so the laser processing technology as well as equipment is being popularized in the apparel industry at an alarming rate to be promoted and popularized.
1, laser cutting applications
Laser cutting process, will not make the fabric deformation or wrinkles, laser cutting high dimensional accuracy, laser cutting shape can be changed arbitrarily with the drawing, increasing the practicality of the design and creativity. In addition, laser cutting technology is a "laser knife" instead of a metal knife, laser cutting of any fabric, can instantly melt and solidify the kerf, small gaps, high precision to achieve automatic "lock" function. The traditional process of cutting with a knife mold or thermal processing, the incision is easy to dehairing, yellowing, hardening.
2, laser engraving applications
Laser engraving is the use of software technology, according to the design of the manuscript input data for automatic engraving. Laser engraving is the most mature laser processing technology in the apparel industry, the most extensive use of technology, can carve any complex graphic symbols, but also can be shot through the skeleton engraving and surface engraving, so as to carve out the depth of the different texture, with a sense of hierarchy and transition of the color effect of a variety of patterns.
3, laser marking applications
Laser marking with high marking accuracy, speed, marking clear and so on. Laser marking is compatible with the laser cutting, engraving technology of various advantages, can be in a variety of materials for precision machining, but also can be processed in small size and complex patterns, laser marking has never wear and tear of the anti-counterfeiting properties.
Second, the application of the electronics industry
Laser processing technology is non-contact processing, so does not produce mechanical extrusion or mechanical stress, especially in line with the electronics industry's processing requirements. In addition, but also because of the laser processing technology of high efficiency, pollution-free, high precision, small heat-affected zone, so in the electronics industry has been widely used.
1, laser scribing
Laser scribing technology is the key technology for the production of integrated circuits, with fine scribing lines, high precision (line width of 15-25 μm, groove depth of 5-200 μm), fast processing speed (up to 200mm/s), and the yield rate of 99.5% or more. During the production of integrated circuits, thousands of circuits have to be prepared on a substrate, and they have to be split into individual cores before encapsulation. The traditional method is to cut with a diamond grinding wheel, and the surface of the silicon wafer produces radial cracks due to mechanical forces. Scribing with laser scribing technology focuses a laser beam on the surface of the wafer, generating high temperatures that vaporize the material and form grooves. The depth of the groove can be precisely controlled by adjusting the amount of pulse overlap, making it easy to neatly disconnect the wafer along the groove, or to make multiple cuts and direct cuts. As the laser is focused into a very small spot, the heat affected zone is extremely small, cutting a 50μm deep trench, the temperature rise in the trench edge 25μm will not affect the performance of the active device. Laser scribing is non-contact processing, the wafer will not be subjected to mechanical forces resulting in cracks. Therefore, it can achieve the purpose of improving the utilization rate of silicon wafers, high yield rate and good cutting quality. It can also be used for scribing of monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cells as well as scribing and cutting of silicon, germanium, arsenicals and other semiconductor substrate materials.
2, laser fine-tuning
Laser fine-tuning technology can be specified on the resistance of automatic precision fine-tuning, accuracy of up to 0.01% of a 0.002% than the traditional method of high precision and efficiency, low cost. Integrated circuits, sensors in the resistance is a layer of resistance film, manufacturing error of up to 15 a 20%, only to the correction, in order to improve the yield of those high-precision devices. Laser can be focused into a very small spot, concentrated energy, processing on the neighboring components of the thermal impact is minimal, does not produce pollution, and easy to control with a computer, so it can meet the rapid fine-tuning of the resistor to reach the precise predetermined value of the purpose. The laser beam is focused on the resistive film to vaporize the material. Fine-tuning of the first resistance measurements, the data transmitted to the computer, the computer according to the pre-designed repair and adjust the method of instruction beam positioner so that the laser cuts the resistor according to a certain path until the resistance value to reach the set value, the same can be used to laser technology for chip capacitor capacitance correction and hybrid integrated circuits of the fine-tuning. Superior positioning accuracy, so that the laser fine-tuning system in the miniaturization of precision linear combination of signal devices to improve the yield and circuit function.
3, laser marking
Laser marking is the use of high energy density of laser light on the workpiece for local irradiation, so that the surface layer of the material vaporization or color changes in the chemical reaction, so as to leave a permanent marking method. Laser marking has two ways of engraving and mask imaging: mask mode marking with a laser to stencil pattern imaging to the surface of the workpiece and ablation of the mark. Engraving marking is a high-speed full-featured marking system. Laser beam reflected by two-dimensional optical scanning galvanometer through the flat-field optical lens focused on the surface of the workpiece, under computer control in accordance with the set trajectory so that the material vaporized, you can type a variety of text, symbols and patterns, etc., the size of the characters can be from millimeters to micron level, the laser marking is permanent, not easy to wear and tear, which is the product of the security of the special significance of counterfeiting. Has been used in a large number of electronic components, integrated circuits to play the trademark model, to the printed circuit board to play the number and so on. Ultraviolet band laser technology is developing rapidly, due to the material in the ultraviolet wave laser action occurs under the electronic energy band jump, break or weaken the bond between the molecules, thus realizing the stripping process, the processing edge is very neat, so in the laser marking technology, especially by the microelectronics industry's attention.