Smt placement is actually a series of PCB based processing.
SMT is a surface mount technology, is a popular technology and process in the electronic assembly industry, SMT SMD is based on the PCB, first, the soldering material solder paste printing to the pads of the bare PCB board Then, using the SMD machine (extended reading: SMD machine components and structure overview) to mount electronic components to the pads of the bare PCB board, Then, the Then, the PCB board into the reflow soldering, soldering, SMT placement is after a process, the electronic components will be mounted on the bare PCB.
SMT SMD process flow introduction
SMT SMD basic process components: screen printing, testing, mounting, reflow soldering, cleaning, testing, repair
1, screen printing: solder paste or patch adhesive leakage printed to the PCB pad, for the welding of the components to prepare. The equipment used is (stencil printing machine), located in the forefront of the SMT production line.
2, testing: testing the quality of printing machine solder paste printing, check the PCB board printing the amount of tin and solder paste position, check the flatness of the solder paste printing and thickness, check whether the solder paste printing offset as well as the printing machine solder paste stencil molding whether the phenomenon of pulling the tip of the phenomenon, etc., the equipment used for the (SPI) solder paste thickness detector. Extended reading: SPI is what SPI detection means SPI inspection equipment role?
3. Mounting: its role is to accurately install the surface assembly components to a fixed position on the PCB. The equipment used is the placement machine, located in the SMT production line behind the screen printing machine.
4. Reflow soldering: its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used for the reflow oven, located in the SMT production line behind the mounter.
5. Cleaning: its role is to assemble the PCB board above the harmful welding residues such as flux removed. The equipment used for the cleaning machine, the location can not be fixed, can be online, or not online.
6. Detection: its role is to assemble the PCB board for welding quality and assembly quality testing. The equipment used are magnifying glass, microscope, online tester (ICT), automatic optical inspection (AOI) Extended reading: what is AOI? Detailed automatic optical inspection equipment aoi, X-RAY inspection system, functional tester and so on. Location according to the needs of the test, can be configured in the production line in the appropriate place.
7. Rework: its role is to detect the failure of the PCB board rework. Tools used for the soldering iron, rework workstations, etc.. Configured in any position in the production line.