1, Chip On Board (Chip On Board, COB) process is first in the substrate surface with thermally conductive epoxy resin (generally with silver-doped particles of epoxy resin) covering the silicon wafer placement point, and then the silicon wafer directly on the surface of the substrate, heat treatment to the silicon wafer solidly fixed in the substrate until the subsequent use of wire soldering in the silicon wafer and the substrate between the establishment of a direct electrical connection.
2, SMT is surface assembly technology (surface mounted technology) (Surface Mounted Technology acronym), is the most popular electronic assembly industry in a technology and process.
It is a pinless or short-lead surface assembly components (referred to as SMC / SMD, the Chinese name of the chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through the re-flow soldering or dip soldering and other methods to be welded and assembled circuit assembly technology.
3, plug-in processing is also the plug-in components welded to the PCB board.
4, the binding is said to be Bonding, playing line, there are gold and aluminum wire.
Expanded Information:
COB: (chip On board) is bonded to a printed board, as IC suppliers are reducing QFP (a type of package for SMT parts) in the production of LCD control and related chips package production. As a result, the conventional SMT method is gradually being replaced in future products.
The main welding methods are
1, hot press welding
The use of heat and pressure to make the wire and the weld zone pressure welding together. The principle is to heat and pressure, so that the weld area (such as AI) plastic deformation at the same time to destroy the oxidation layer on the interface of the pressure welding, so that the attraction between the atoms to achieve the purpose of "bonding".
In addition, the two metal interfaces are uneven heating and pressure can make the upper and lower metal inlay each other. This technology is generally used for the glass plate chip COG.
2, ultrasonic welding
Ultrasonic welding is the use of ultrasonic generator energy, through the transducer in the ultra-high frequency magnetic field induction, rapid expansion of elasticity vibration, so that the splitter vibrate accordingly, at the same time in the splitter knife on the application of a certain amount of pressure, so the splitter knife in the two kinds of force *** with the same action, drive AI wire in the welded area of metallization layer such as (Metalized layer of the metalized layer of the metalized layer of the metalized layer of the metalized layer of the metalized layer of the metalized layer of the welded area. The metallization layer such as (AI film) surface friction quickly, so that the AI wire and AI film surface produces plastic deformation.
This deformation also destroys the oxidized layer at the interface of the AI layer, so that the two pure metal surfaces are in close contact with each other to achieve inter-atomic bonding, thus forming a weld. The main welding material is aluminum wire welding head, generally wedge-shaped.
3, gold wire welding
Ball welding in the lead bonding is the most representative of the welding technology, because now the semiconductor package diode, triode package are used AU wire ball welding.
It is easy to operate, flexible, strong solder joints (diameter of 25UM AU wire welding strength is generally 0.07 ~ 0.09N / point), and non-directional, the welding speed can be as high as 15 points / second or more.
Gold wire welding is also called thermal (pressure) (super) sound welding main bonding material for the gold (AU) wire welding head for the ball so for the ball welding.
Baidu Encyclopedia - COB
Baidu Encyclopedia - SMT Chip
Baidu Encyclopedia - Electronics Production Process