Importance of High Frequency Copper Clad Laminate

High-frequency copper-clad laminates are copper-clad laminates with ultra-low loss characteristics (ultra-low signal transmission loss) that are applied to ultra-high frequency applications with operating frequencies above 5GHz. High-speed copper-clad laminates are copper-clad laminates that are used in high-frequency applications with high signal transmission speeds (10-50Gbps), high characteristic impedance (Zo) accuracy, low transmission signal dispersion (less distribution of bias circuits), and low loss (Df between 0.005 and 0.01).

High-frequency and high-speed copper-clad laminate production process often needs to be carried out in hundreds of degrees of high-temperature press, the process of maintaining the stability of the Dk has a greater degree of difficulty, and Rogers and Panasonic is the link with its own mature technology and materials to improve the technology, in order to monopolize the market of high-frequency and high-speed copper-clad laminate for a long time. Among them, Rogers is through the use of hydrocarbon/ceramic filler (RO4350B) to improve the thermosetting of the resin or the use of PTFE/ceramic filler (RO3000) to change the thermoplasticity of the resin to achieve the high temperature stabilization of Dk way.

The growth logic of high-frequency and high-speed copper-clad laminates comes from the release of demand for high-frequency and high-speed PCBs. High-frequency high-speed CCL is one of the core materials of high-frequency high-speed PCB. By high-frequency high-speed CCL as the basic material made of high-frequency high-speed PCB is widely used in communications electronics, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense, aerospace and aviation and other fields.

Including high-frequency copper-clad laminate in the 5G antenna system, automotive electronics ADAS system use obvious, high-speed copper-clad laminate in the cloud server IDC, high-end routers and other applications.