Photolithography is the basis for manufacturing chips.
In fact, most people believe that chip technology is a comprehensive level of technology, and photolithography puts ? sharp knife? , stabbed in the heart, the chip is life, photolithography is the existence of protection. However, our country because of the limitations of the photolithography machine, for us, no photolithography machine, be alert to the crisis brought about by the chip. So, is it difficult to manufacture chip manufacturing? What is the relationship between the photolithography and the chip, why there is no photolithography can not make the chip?
A chip molding, applied to the device, need to go through a number of steps: design, manufacturing and packaging and testing. Design and manufacturing is the essence of the chip, said the design, familiar with Qualcomm, Apple and other technology companies are termed design companies. Through the EDA design, it must be mentioned that this software is the weakness of our chips. Design, Huawei can do to meet the needs of the design, the key in the manufacturing level. The steps of chip manufacturing, easier to understand the degree of difficulty in chip manufacturing.
Refining wafers, refining monocrystalline silicon, made into silicon ingots, and then cut into several rounds, which is what becomes a wafer; applying photoresist on the wafer is a constraint on our development. Photoresist, from Japan and the United States of America two major countries, especially high-end, glue developer only Japan can manufacture; in the wafer coated with photoresist, through the photolithography light source, so that the glue is cured, in accordance with the design of the line diagram, no line diagram, the wafer is cured and cured line diagram. Unfortunately, the U.S. light source, as well as the German lens composed of ASML's photolithography; etching, etching in China is developing rapidly. Need to dissolve the excess coating. Photoresist has been cured, it must be known that the unwanted coating has also disappeared traces; into the etching, dissolve the unwanted coating, leaving the photolithography, the formation of grooves. Ionic elements are injected to change the conductive properties.
The steps of the chip lack a photolithography machine. Including EDA-related design software; Japan and the United States photoresist, coating developer, photolithography, and ion implanter are key.