What is SMT, DIP, its production process and considerations?

DIP package (Dual In-line Package), also known as dual in-line package technology, refers to the use of dual in-line form of integrated circuit chip package, the vast majority of small and medium-sized integrated circuits are used in this package form, the number of pins is generally no more than 100. DIP package CPU chip has two rows of pins, need to be inserted into the chip socket with DIP structure.

Surface

Surface Mount Technology SMT

Surface Mount Technology, known in English as "Surface Mount Technology", referred to as SMT, which is the surface mount components paste, welded to the surface of the printed circuit board in the specified location of the circuit assembly technology, the responsible for the use of the printed circuit board without unprincipled drilling. Circuit boards without unprincipled drilling. Specifically, it is the first in the printed circuit board circuit plate coated with solder paste, and then the surface mounted components accurately placed on the coated solder paste pads, through the heating of the printed circuit board until the solder paste melts, after cooling, it will realize the meta device and the interconnection between the printed circuit board. 1980's, SMT production technology is becoming more and more sophisticated, used for the surface mounting technology, mass production of components, the price has fallen dramatically, a variety of technically good, low-priced, and the surface mounting technology, the surface mounting technology, the surface mounting technology, the surface mounting technology, the surface mounting technology, the surface mounting technology. A variety of technical performance, low-priced equipment have come out, with SMT assembly of electronic products with a small size, good performance, full-featured, low price advantage, so SMT as a new generation of electronic assembly technology, is widely used in aviation, aerospace, communications, computers, medical electronics, automotive, office automation, home appliances and other areas of electronic products in the assembly.