Electronic instrumentation circuit board production process?

As far as I know, the production process of electronic instrumentation circuit boards is as follows: In electronic assemblies, printed circuit boards (Printed Circuit Boards) are a key component. It carries other electronic parts and connects the circuit to provide a stable circuit working environment. Such as its circuit configuration can be summarized into three categories: 1, single-panel will provide parts connected to the metal line layout in the insulated substrate material, the substrate is also the installation of parts of the support carriers. 2, double-sided board when the single-sided circuit is not enough to provide electronic parts connection needs, the circuit can be arranged on both sides of the substrate, and in the board to build through-hole circuits to connect the two sides of the board. In more complex applications, circuits can be arranged in multiple layers and pressed together, and through-hole circuits are built between the layers to connect the circuits. Inner Layer Circuits Copper-clad substrates are cut to size to fit the production process. Before pressing the film on the substrate, it is usually necessary to use brushing and grinding, micro-etching and other methods to make the copper foil on the surface of the board to do the appropriate roughening treatment, and then with the appropriate temperature and pressure to the dry film photoresist close adherence to it. The substrate with the dry film photoresist is sent into the UV exposure machine for exposure, the photoresist will be polymerized after UV irradiation in the light-transparent area of the negative (the dry film in this area will be retained as an etching resist in the developing and copper etching steps later), and the image of the line on the negative will be transferred to the dry film photoresist on the board surface. After removing the protective film on the film surface, the first aqueous solution of sodium carbonate will be used to develop the unilluminated areas of the film surface to remove, and then a mixture of hydrochloric acid and hydrogen peroxide will be used to etch away the exposed copper foil to form the line. Finally, the dry film photoresist is washed away with aqueous sodium hydroxide solution. For inner layer circuit boards with six layers (or more), the riveting reference holes are punched out by automatic positioning punching machine to align the lines between layers. Pressing After the completion of the inner layer of the circuit board must be glass fiber resin film and the outer layer of the line of copper foil bonding. Before pressing, the inner layer board should be black (oxygen) treatment, so that the copper surface passivation to increase the insulating properties; and make the copper surface of the inner line roughened in order to be able to produce a good bonding properties and film. Stacking first six layers of lines [including] more than the inner layer of the circuit board with riveting machine riveted together in pairs. Then use the tray to neatly stacked in the mirror between the steel plate, into the vacuum press with the appropriate temperature and pressure to make the film hardening adhesion. After pressing, the circuit board is drilled with X-ray automatic positioning drilling machine to make the target holes as the benchmark holes for the alignment of the inner and outer circuits. The edges of the boards are cut to facilitate subsequent processing. Drilling The circuit boards are drilled with CNC drilling machines to create holes for interlayer circuits and fixing holes for soldered parts. The boards are secured to the drilling machine with pins through the previously drilled target holes, along with a flat bottom plate (phenolic resin or wood pulp) and a top plate (aluminum) to minimize the occurrence of drilling burrs. Plating through holes Primary Copper After the interlayer vias are formed, a metallic copper layer is laid on them to complete the interlayer circuit conduction. Heavy brushing and high-pressure rinsing are used to clean up the burrs and dust in the holes, and potassium permanganate solution is used to remove the slag on the copper surface of the hole wall. A tin-palladium gelatinous layer is immersed in the cleaned hole wall and reduced to metallic palladium. The circuit board is immersed in a chemical copper solution, and by the catalytic effect of palladium, the copper ions in the solution are reduced and deposited on the hole wall, forming a through-hole circuit. The copper layer inside the through-hole is then thickened by copper sulfate bath plating to a thickness sufficient to resist subsequent processing and environmental impacts. Outer Layer Circuit Secondary Copper The production of circuit image transfer is similar to that of the inner layer circuit, but the etching of the circuit is divided into two production methods: positive and negative. Negative film is produced in the same way as the inner layer of the line, and is completed by directly etching copper and removing the film after development. Positive film production method is to develop and then plated with secondary copper and tin-lead (tin-lead in the region will be retained later in the etching step as an etching resist), to remove the film to alkaline ammonia, copper chloride mixed solution will be exposed to remove the copper foil corrosion, the formation of the line. Finally, the tin-lead layer is stripped off with tin-lead stripping solution (in the early days, there was a practice of retaining the tin-lead layer and using it to cover the line as a protective layer after remelting, but it is not used now). Solder Resist Green Paint After the outer layer of wiring is completed, an insulating resin layer is applied to protect the wiring from oxidization and soldering short circuits. Before coating usually need to use brush grinding, micro-etching and other methods of circuit board copper surface to do the appropriate roughening cleaning process. And then screen printing, curtain coating, electrostatic spraying ... and other ways of liquid photopolymerized green paint coated on the board surface, and then dry pre-drying (dry film photopolymerized green paint is a vacuum film press will be pressed together on the board surface). After cooling down, the green lacquer is exposed in a UV exposure machine. The green lacquer will be polymerized in the light-transparent area of the negative by UV irradiation (the green lacquer in this area will be retained later in the development step), and the unlighted area of the coated film will be developed with aqueous sodium carbonate solution to remove the light-transparent area of the coated film. Finally, the resin in the green lacquer is completely hardened by baking at high temperatures. Earlier green lacquers were produced by direct hot baking (or UV irradiation) after screen printing to harden the film. However, due to the printing and hardening process will often cause the green paint penetration into the copper surface of the terminal joints of the line, resulting in parts soldering and the use of trouble, now except for the line of simple and rugged circuit boards, more than the use of light-sensitive green paint for the production. Text Printing The text, logo or part number required by the customer is printed on the board surface by screen printing, and then the text ink is hardened by hot baking (or ultraviolet irradiation). Junction Processing Soldermask covers most of the copper surface of the circuitry, leaving only the termination point for soldering, electrical testing, and board insertion. The terminals require an additional layer of protection to prevent oxidization of the anode (+) terminals during long-term use, which could affect circuit stability and cause safety concerns. Gold plating on the board's plug terminals (commonly known as gold fingers) coated with a layer of high hardness and wear-resistant nickel layer and a high chemical passivity of the gold layer to protect the endpoints and provide good connectivity. Tin spraying covers the soldered end points of the board with a tin-lead alloy layer by hot air leveling to protect the end points of the board and provide good soldering performance. Pre-soldering on the circuit board soldering endpoints to cover a layer of antioxidant pre-soldering film by dip-dyeing to temporarily protect the soldering endpoints before soldering and provide a more flat soldering surface, so as to have good soldering performance. Carbon Ink A layer of carbon ink is screen-printed on the contact endpoints of the board to protect the endpoints and provide good connectivity. Forming and Cutting The circuit boards are cut by CNC molding machine (or die press) to the customer's required dimensions. During cutting, the boards are fixed to the bed (or mold) with pins through previously drilled holes. After cutting, the gold fingers are beveled to facilitate the insertion of the board. For multi-chip molded boards, X-shaped break lines are often added to facilitate the customer to split and disassemble the board after insertion. Finally, the boards are cleaned of dust and ionic contaminants on the surface. Final Inspection and Packaging Before packaging, the circuit boards are subjected to final electrical conduction and impedance tests, as well as soldering and thermal shock resistance tests. And moderate baking to eliminate the circuit board in the process of adsorption of moisture and the accumulation of thermal stress, and then finally packaged in a vacuum bag for shipment. (I hope the above content is helpful to you!) Q: These production machinery required in how much money, and is about how much money to produce a finished product Answer: This specific is not able to account for the cost of each device, because there are good machinery, there are poor machinery, these machines are not good to buy on the market. Questions： Now which place to do this more Answer: Online can be bought. Give you a Web site you go to see it: / Q: Which place to produce this instrumentation circuit board more Answer: Hangzhou should be the most in the country! Q: the production of this circuit board there is no high technical content. Answer: Yes. Q: that technology can be bought or where to learn Answer: This specific I do not know. Q: What is the scientific name of the machinery of each process, do you know Answer: This specific I do not know! Q: that circuit board above the "wire" how to get on the Answer: This specific I would be difficult to elaborate. I'm sorry,