Thermally conductive spacers are used to fill the air gap between a heat generating device and a heat sink or metal base, and their flexible, elastic characteristics allow them to be used to cover very uneven surfaces. Heat is conducted from the separating device or the entire PCB to the metal casing or diffuser plate, which can increase the efficiency and longevity of heat-generating electronic components.
In the use of gaskets, pressure and temperature are both constraints on each other, as the temperature rises, after a period of time in the operation of the equipment, the gasket material softening, creep, stress relaxation phenomenon, the mechanical strength will also be reduced, the pressure of the seal to reduce.
In the use of gaskets, pressure and temperature are mutual constraints, with the rise in temperature, after a period of time in the operation of the equipment, the gasket material softening, creep, stress relaxation phenomenon, mechanical strength will also decline, sealing the pressure is reduced. And vice versa.
Silicone thermal conductive gasket general characteristics:
(1) good elasticity and recovery, can adapt to pressure changes and temperature fluctuations;
(2) appropriate softness, can be well adhered to the contact surface;
(3) does not contaminate the process medium;
(4) have Sufficient toughness without breaking the ring due to pressure and fastening force;
(5) No hardening at low temperature, small shrinkage;
(6) Good processing performance, easy to install and press;
(7) No bonding of the sealing surface, easy to dismantle;
(8) Competitive cost, long service life.
Thermally Conductive Gasket Application Fields:
-Aerospace, military and automotive electronics cooling heat generating components, such as electronic devices, semiconductor memory devices, etc.;
-General-purpose frequency converters, medical equipment, DSC;
-Automotive electronics, such as on-board cameras, motor control units, car navigation
-automotive electronics, such as in-vehicle cameras, motor control units, automotive navigation, automotive lighting (LED);
-laser HUD light source;
-3C consumer products and handheld electronics (e.g., cell phones, tablets, computers, AR/VR, etc.);
-base stations, chassis, IGBT modules.