1.FR4: FR4 is a commonly used glass fiber reinforced epoxy resin material, which has good insulation performance, heat resistance and mechanical strength and is suitable for most applications.
2. High frequency board: used for high frequency signal transmission.
PCB requires lower signal loss and better RF characteristics. Common high-frequency boards are: PTFE (polytetrafluoroethylene), FR4+ high-frequency layer, RF series, etc.
3. Metal substrate: The metal substrate has excellent heat dissipation performance and is suitable for electronic equipment requiring high power, such as LED lamps and power amplifiers. Common metal substrate materials are: aluminum substrate, copper substrate and so on.
4. Multilayer board: Multilayer board is composed of several thin printed circuit boards, which are connected by internal electrical connection layers. Multilayer boards are usually used in devices that require complex circuit wiring, such as computer motherboards and communication equipment.
In addition, there are some special plates for specific applications, such as high-temperature PCB materials and flexible PCB materials. Choosing the right board depends on the specific application requirements and design requirements.