Mobile Communications is a leading global provider of Internet of Things (IoT) solutions. Our mission is to connect devices and people to networks and services, driving digital innovation and helping to build a smarter world. Our products help enable a more convenient, efficient, comfortable, prosperous and secure life.
Since its founding in 2010, CMO has rapidly become the fastest growing cellular module supplier in the world and is now the largest cellular module supplier in the industry.
Let's talk about the company's products, as an example
The CMO RM500Q-AE is a 5G Sub-6 GHz module designed for IoT/eMBB applications. Adopting 3GPP Release 15 technology, the RM500Q-AE supports both 5G NSA and SA modes. RM500Q-AE is packaged in M.2 package and is compatible with CMCC LTE-A Cat 6 module EM06, Cat 12 modules EM12-G, EM120R-GL, EM121R-GL, and Cat 16 module EM160R-GL, making it easy for customers to migrate from LTE-A to 5G. migration from LTE-A to 5G.
The RM500Q-AE module is an industrial-grade module, suitable for industrial and commercial applications only.
The RM500Q-AE covers almost all major carriers worldwide. The integrated multi-constellation, high-precision positioning GNSS (supporting GPS, GLONASS, BeiDou and Galileo) receivers simplify product design while greatly improving positioning speed and accuracy.
The RM500Q-AE has a rich set of built-in network protocols, integrates multiple industry standard interfaces, and supports a variety of drivers and software features (e.g., USB/PCIe drivers for Windows 7/8/8.1/10, Linux, Android, etc.), which greatly expands its scope of application in the IoT and eMBB fields, such as industrial-grade routers, home gateways, and industrial-grade network equipment. Routers, home gateways, set-top boxes, industrial laptops, consumer laptops, industrial PDAs, ruggedized industrial
tablets, video surveillance and digital signage.
L76 Series Modules (L76, L76-L, and L76B)
Key Features:
Compact size and ease of use
Extensive functionality interfaces
Micro-USB interface for power supply and data transfer
Module operating Status indicator
Suitable external batteries available
This evaluation kit contains:
One-page instruction manual describing EVB connectivity, EVB accessories
Micro-USB cable
GNSS active antenna (3.3V)
CD-ROM with USB driver and related documentation
The BG600L-M3 is a multi-mode (LTE Cat M1, LTE Cat NB2, and EGPRS) LPWA module that supports the 3GPP Release 14 protocol specification. The module supports a maximum uplink rate of 1119 kbps and a maximum downlink rate of 588 kbps in LTE Cat M1 networks, and utilizes a built-in MCP and ThreadX-enabled ARM Cortex A7 processor to deliver ultra-low power consumption, with a 70% reduction in PSM power consumption and an 85% reduction in power consumption in eDRX mode when compared to comparable LPWA modules.
The BG600L-M3 has a full suite of hardware-based security features designed to allow trusted applications to run directly on the Cortex A7 TrustZone engine. With a package size of 18.7 mm, 16.0 mm, and 2.1 mm, the BG600L-M3 also features low power consumption, high integration, and high mechanical strength to maximize customer product development. The module's LGA package is particularly well suited to the automated placement requirements of contemporary mass production, with easy SMT soldering and after-sales maintenance.
A wide range of Internet protocols, industry standard interfaces, and rich functionality extend the module's applicability to a wider range of M2M applications, such as wireless POS, smart metering, tracking, wearables, and more.
AG550Q is a series of automotive-grade 5G NR Sub-6GHz modules developed by MobileTech, supporting 5G NR Standalone (SA) and Non-Self-contained (NSA) modes. Adopting 3GPP Rel. 15 technology, the modules can support up to 2.12Gbps downlink and 900Mbps uplink in 5G NR networks, and up to 2.02Gbps downlink and 75Mbps uplink in LTE-A networks. With its C-V2X PC5 direct communication function (optional), the AG550Q can be widely used in the field of Telematics, providing a reliable solution to realize the establishment of smart cars, autonomous driving and intelligent transportation systems. Meanwhile, the module supports dual SIM card and dual pass-through (optional) and rich functional interfaces, providing great convenience for customers to develop applications. Its excellent ESD and EMI protection performance ensures its robustness in harsh environments.
To meet different market needs, the AG550Q*** consists of a series of models: AG550Q-CN, AG550Q-EU, AG550Q-NA, and AG550Q-ROW. At the same time, the module is backward compatible with existing GSM, UMTS, and LTE networks, so it can be used in areas where 5G NR networks are not currently deployed, and in remote areas where 3G/4G networks are not available. 4G network coverage in remote areas.
The AG550Q supports Multiple Input Multiple Output (MIMO) technology, which uses multiple antennas at the transmitter and receiver ends of the same frequency band, allowing signals to be transmitted and received through multiple antennas at both the transmitter and receiver ends, resulting in a significant reduction in BER and improved communication quality. The module supports Qualcomm IZat positioning technology Gen9VT Lite (GPS, GLONASS, BeiDou, Galileo, and QZSS), which, combined with its optional QDR 3.0 and multi-frequency GNSS receivers (L1/L2/L5), simplifies product design while providing faster, more accurate, and more reliable positioning services.
The modules provide OEMs and Tier 1 automotive component suppliers with safe and reliable connected car solutions, as well as automakers with smart and flexible self-driving car manufacturing solutions, and can be widely used in telematics processors (T-Box), telematics control units (TCUs), advanced driver assistance systems (ADAS), C-V2X ( V2V, V2I, V2P) systems, On-Board Units (OBUs), Roadside Units (RSUs), and other smart grid and vehicle manufacturing applications.
AF50T is a new automotive-grade, high-performance, low-cost Wi-Fi 6 & BT 5.1 module from CMO, supporting 2 2 MU-MIMO and up to 1774.5Mbps. Its ultra-compact package size of 19.5 mm, 21.5 mm, and 2.3 mm maximizes the demand of end-products for small-sized modules, and helps customers to efficiently and effectively use the AF50T in their applications. The ultra-compact package size of 19.5 mm, 21.5 mm and 2.3 mm can meet the demand for small-size modules in end products and help customers to effectively reduce product size and optimize product cost. The module is designed to work with Mobile Telecom's automotive-grade LTE-A/5G modules, AG520R/AG550Q, to create a reliable LTE-A/5G+Wi-Fi/BT application.
Utilizing SMT chip technology, the AF50T is highly reliable and capable of meeting the demands of applications in complex environments. The compact LGA package makes it ideal for size constraints and reliable network connectivity. This package type is suitable for large-scale, automated production, helping to reduce production costs and increase productivity.
Based on a reliable PCIe 2.0 interface, the module enables high-rate, low-power WLAN wireless transmission. Combined with its compact size, low power consumption, wide temperature range, and high reliability, the AF50T meets the needs of a wide range of in-vehicle applications.
QuecHub operates on one end as a bridge device through an IoT protocol gateway and on the other end as a customer application. Unified cloud access is immediately and creatively accomplished using cloud-deployable modules with single-step loading. The interface also provides a RESTful API gateway that supports easy coding, enabling rapid integration of devices with a variety of web and mobile applications.
Global IoT device connectivity is growing strongly, with IoT Analytics estimating that more than 30 billion IoT devices, both cellular and non-cellular, will be connected globally by 2025. According to GSMA data, the market size of China's IoT industry will be about 1.7 trillion in 2020, and it is expected that the market size will reach 2.8 trillion in 2025, with a CAGR of 11%, and China will lead the development of the global IoT industry. Module to undertake the upstream and downstream ends of the Internet of Things industry chain, directly benefiting from the upstream and downstream high boom degree.
Domestic IoT chip manufacturers to speed up the process of domestic substitution, will significantly reduce the cost of module manufacturers, drive the growth of midstream module demand. Based on the universality and customizability of the module itself, the module industry is fully benefiting from the multifarious needs of downstream vertical applications, with a broad market space; the launch of Hongmeng will bring incremental volume for downstream application scenarios; China Mobile has opened the procurement of 5G general-purpose modules, which will drive down module prices, promote the expansion of 5G industry applications, and further drive the outbreak of demand for 5G modules.
Vehicle module is an important underlying hardware for automobile access to Telematics, which can be applied to different fields of automobile such as mainframe, T-BOX, OBD, OTA, etc. Along with the iteration of communication technology and the development of intelligent technology, it can be applied to different fields of automobile. Along with the iteration of communication technology and the development of smart cars, the demand for in-vehicle modules has ushered in an outbreak. JOS Auto Research expects that the loading capacity of global automotive wireless communication module will reach 200 million pieces in 2025, with a CAGR of 15% from 2020 to 2025, among which the loading capacity of China's automotive wireless communication module will reach 90 million pieces, with a CAGR of 19% from 2020 to 2025; the penetration rate of 5G module will be improved, and JOS Auto Research expects that the assembly rate of China's automotive 5G wireless communication module will reach about 35% in 2025, which is the highest among the automotive industry. The assembly rate of automotive 5G wireless communication modules in China is expected to reach about 35% in 2025.
As the performance requirements of automotive-grade products for implementation of conduction, safety, stability and other aspects are more stringent than those of consumer-grade and industrial-grade products, and the integration degree of 5G automotive-grade modules is further improved, the value of automotive modules, especially 5G automotive modules, is higher than the value of a single product. In the future, intelligent networked cars will be gradually popularized, the penetration rate of in-vehicle modules will continue to increase, and the industry is expected to meet the development opportunities of volume and price increase.
The company has a complete product line of in-vehicle modules covering cutting-edge technologies such as 5G, LTE, C-V2X, Wi-Fi6 and high-precision GNSS positioning, and has developed a rich range of products based on the world's leading automotive platforms, which is in line with the technological continuity demanded by automobile manufacturers for the upgrading and replacement of smart vehicles. Mainly used in T-BOX, car navigation system and other scenarios, nearly 50 mass production projects have been delivered globally. The company's domestic 4G communication module market share ranked first, along with the high growth of smart car boom, the car module market will open up long-term growth space for the company.