Who can detail the INTEL Pentium, Celeron development process and the models of each generation!
In fact, the role of the processor and the brain is more similar, because it is responsible for processing, computing all the data inside the computer, while the motherboard chipset is more like a heart, it controls the exchange of data. CPU type determines the type of operating system you use and the corresponding software, the speed of the CPU determines how powerful your computer, the faster, the newer, the more powerful, the more powerful.
The faster and newer the CPU, the more money it will cost you.
Today, Intel's CPUs and their compatibles rule most of the microcomputer-PCs, so the CPU Evolution series of articles focuses on these CPUs and what you need to know about how they're made, how they work, how they perform, what kinds they are, and more. Whether it's an Intel or AMD CPU, or some of the others you may have heard of (such as those used in iMacs or SGI workstations), they all have a lot of similarities.
The core of a CPU
From the outside, CPUs often appear to be rectangular or square blocks connected to the motherboard by a dense array of numerous pins. However, what you see is nothing more than the outer shell of the CPU - the CPU package. And inside, the core of the CPU is a size usually less than 1/4 inch thin silicon chip (its English name is die, core), as Figure 1. in this small piece of silicon, densely packed with millions of transistors, they seem to be like the brain's neurons, coordinate with each other, to complete a variety of complex calculations and operations.
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It should be noted that the line width refers to the most basic functional unit on the chip - the width of the gate circuitry, because in fact, the width of the wires between the gate circuitry with the width of the gate circuit, so the line width can be the same as the width of the gate circuit. Because the width of the wires connecting the gates is actually the same as the width of the gates, linewidth describes the manufacturing process. Shrinking the line width means that the transistors can be made smaller and denser, which reduces the power consumption of the chip, the system is more stable, the CPU is able to run at a higher frequency, and smaller wafers can be used for the same level of complexity of the chip, which reduces the cost.
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With the continuous reduction of the line width, the conductivity of the aluminum connecting line used inside the previous chip will not be enough to use the processor in the future will use the conductive characteristics of the better copper connecting line, AMD has just launched a new member of the K7 family
CPU packaging
After passing several rigorous tests, the silicon chip that has been prepared for various circuit structures can be sent to the packaging plant to be cut, divided into individual processor die and placed into the package. The package is more than just a pretty coat. Thanks to the protection of the package, the processor core is isolated from the air to avoid contaminants. In addition to this, a good package design helps to dissipate heat from the chip. At the same time, it is the bridge between the processor and the motherboard.
Encapsulation technology is also evolving, the most common is the PGA (Pin-Grid Array, Pin Grid Array) package (Figure 2 is the Pentium CPU has a pin side), usually this package is square, in the central area around the uniform distribution of three to four rows or even more! More rows of pins, the pins can be inserted into the corresponding jacks on the motherboard CPU socket. With the increase in CPU bus width, enhanced functionality, the number of CPU pins is also increasing, while the heat dissipation, electrical characteristics also have higher requirements, evolved SPGA (Staggered Pin-Grid Array), PPGA (Plastic Pin- Grid Array, Plastic Pin-Grid Array, Plastic Pin-Grid Array, Plastic Pin-Grid Array, Plastic Pin-Grid Array, Plastic Pin-Grid Array). Grid Array), PPGA (Plastic Pin-Grid Array).
The Pentium III Coppermine uses a unique FC-PGA (Flip Chip Pin-Grid Array) package, shown in Figure 3, which puts the core of the device "upside down" under the package substrate. Package substrate under the core flipped 180 degrees, sitting on top of the package substrate, which can shorten the connection line, and is conducive to heat dissipation. However, this is not Intel's what the invention of the move, when AMD in the K6 processor used a similar technology (from IBM to buy the patent), but because of a piece of metal on the cover of the "cover" and not known, the new Socket A series CPU is also used in a similar technology.
CPU connectors
The types of connectors that connect to the motherboard often vary depending on the architecture of the CPU.
The most common socket in the 586 era was the Socket 7 socket, shown in Figure 4, which is a square, multi-pin, angled, zero-plug-force socket with a lever on the socket that allows you to easily insert or remove a CPU chip by simply pulling the lever upward when installing or replacing a CPU.The Socket 7 socket is available for the Intel Pentium, Pentium MMX, AMD K5, K6, K6-2, K6-III, Cyrix 6X86, X86 MX, MⅡ and other processors.
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The Slot 1 slot (shown in Figure 6) is a proprietary Intel technology that is a narrow 242-pin slot that supports the use of a Single-Edge Connector (SEC).
Intel's first SEC package is actually a PGA package fixed on a daughter card
Intel's first CPU 4004, a 4-bit processor with 108kHz and 0.06 MIPs (Million Instruction Paths). MIPs (Million Instructions Per Second), 2,300 integrated transistors, 10-micron manufacturing process, 640 bytes of maximum addressable memory, production date November 1971.
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8008, 8-bit processor, 200kHz, 0.06MIPs, 3,500 transistors, 10-micron manufacturing process, 16KB maximum addressable memory, production date April 1972 .
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8080, 8-bit processor, main frequency 2M, computing speed 0.64MIPs, integrated transistors 6,000, 6-micron manufacturing process, the maximum addressable memory of 64KB, the production date of 1974 April.
8085, 8-bit processor, main frequency 5M, computing speed 0.37MIPs, integrated transistors 6,500, 3 micron manufacturing process, the maximum addressable memory 64KB, production date in 1976.
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8086, 16-bit processor, 4.77/8/10MHZ, 0.75MIPs, 29,000 integrated transistors, 3-micron manufacturing process, maximum addressable memory of 1MB, the production date of June 1978. June 1978 .
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8088, 8-bit processor, main frequency 4.77/8MHZ, integrated transistors 29,000, 3-micron manufacturing process, the maximum addressable memory of 1MB, the production date in June 1979.
80286, 16-bit processor, main frequency 6/8/10/12~25MHZ, computing speed up to 2.66MIPs, integrated transistors 134,000, 3 micron manufacturing process, the maximum addressable memory of 16MB, production date in 1982.
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80386DX, 32-bit processor, main frequency 16/20/25/33MHZ, computing speeds of up to 10MIPs, integrated transistors 275,000, 1.5-micron manufacturing process, the maximum addressable memory 4GB, production date. 4GB of memory, manufactured in October 1985.
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80386SX, 16-bit processor, MHZ, 6MIPs, 134,000 transistors, 3-micron process, 16MB of addressable memory, produced in 1988.
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80486DX, DX2, DX4, 32-bit processor, main frequency 25/33/50/66/75/100MHZ, bus frequency 33/50/66MHZ, operation speed 20~60MIPs, integrated transistor, and the speed of the computer. 60MIPs, integrated transistors 1.2M, 1 micron manufacturing process, 168-pin PGA, maximum addressable memory 4GB, cache 8/16/32/64KB, production date April 1989.
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Pentium, 64-bit processor, main frequency 60/66/75/100/120MHZ (P54), 133/150/166/200MHZ (P54C), bus frequency 60/66MHZ. 66MHZ, computing speed of 90 ~ 240MIPs, integrated transistors 3.1 ~ 3.5M, 1 micron manufacturing process, 273 or 296 pins, the maximum addressable memory of 4GB, cache 16/256/512KB, the production date in March 1993.
Pentium MMX (MMX: Multi-Media Extensions, adding 57 multimedia instructions), 64-bit processor, 150/150/166/200/233MHZ (P55C), bus frequency 66MHZ, computing speeds of up to 435MIPs, integrated transistors 4.1 ~ 4.5 M, 1 micron manufacturing process, SOCKET7 interface, maximum addressable memory 4GB, cache 16/256/512KB, production date in March 1993.
Pentium Pro, 64-bit processor, main frequency 133/150/166/180/200MHZ, bus frequency 66MHZ, computing speed up to 300 ~ 440MIPs, integrated transistors 5.5M, 1 micron manufacturing process, 387-pin Socket8 interface, the maximum addressable memory of 64GB, cache 16/256kB ~ 1MB. 256kB~1MB, production date November 1995.
Pentium II, 64-bit processor, main frequency 200/233/266/300/333/350/400/450MHZ, bus frequency 66/100MHZ, computing speed up to 560 ~ 770MIPs, integrated transistors 7.5M, 1 micron manufacturing process, the new SLOT1 interface, the maximum addressed memory 64GB, L1 cache 16kB, L2 cache 512KB, production date in March 1997. (233~333MHz, 2.8V Klamath core, 66MHz FSB; 350~450MHz, 2.0V Deschutes core, 100MHz FSB)
Pentium II Xeon, 64-bit processor, 400/450MHZ mainframe, 100MHZ bus frequency, new SLOT2 interface, maximum addressable memory 64GB, L1 cache 16kB, L2 cache 512KB ~ 2MB, production date 1998.
Celeron generation, main frequency 266/300MHZ (266/300MHz w/o L2 cache, Covington core (Klamath based), 300A/333/366/400/433/466/500/533MHz w/128kB L2 cache, Mendocino core (Deschamps), L1 cache 16kB. Mendocino core (Deschutes-based), 66MHz bus frequency, 0.25 micron manufacturing process, production date April 1998)
Pentium III, 64-bit processor, 450/500Mhz (Katmai core: 2.0V, 100MHz bus frequency, 512kB L2 cache, slot1 interface), 533MHZ~1.13GHZ (Coppermine core: 1.6V, 100/133MHz bus frequency, 256kB L2 cache, Socket 370), 0.25~0.18 micron manufacturing process, production date 1999~2000.
Pentium III Xeon, divided into the early Tanner core (0.25 micron manufacturing process, 256KB cache), later Cascades core (bus frequency 133MHZ, L2 cache 2MB, 0.18 micron manufacturing process), production date in 1999.
Pentium III (Tulatin core), main frequency 1.13G ~ 1.4G, bus frequency 133MHZ, L2 cache 512K, Socket370 interface, 0.13 micron manufacturing process, divided into the server version (S) and laptop mobile version (M), production date in 2001.
Celeron II, main frequency 533MHZ ~ 1GHZ (Coppermine core: 1.6V, bus frequency 66/100MHZ, L2 cache 128K, Socket 370), 0.18-micron manufacturing process, production date 2000.
Celeron III (Tulatin, Tulatin core), main frequency 1GHZ ~ 1.3GHZ, bus frequency 100MHZ, 0.13 micron manufacturing process, Socket 370 interface, 256k L2 cache, absolutely not afraid of the pressure of the core, low-power consumption, heat and other advantages of a change in the Celeron II's various defects, excellent overclocking performance, the
Pentium 4 (Willamette core, 423-pin), frequency 1.3G ~ 1.7G, FSB 400MHZ, 0.18 micron manufacturing process, Socket423 interface, L2 cache 256K, production date November 2000 .
Pentium 4 (478-pin), so far divided into three kinds of core: Willamette core (main frequency 1.5G, FSB400MHZ, 0.18 micron manufacturing process), Northwood core (main frequency 1.6G ~ 3.0G, FSB533MHZ, 0.13 micron manufacturing process, the second level cache 512K), Prescott core (main frequency 1.6G ~ 3.0G, FSB533MHZ, 0.13 micron manufacturing process, the second level cache 512K). Prescott core (from 2.8G, FSB800MHZ, 0.09 micron manufacturing process, 1M L2 cache, 13 new instruction set SSE3), the production date of July 2001 .
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Pentium MMX (MMX: Multi-Media Extensions, 57 additional multimedia instructions), 64-bit processor, 150/150/166/200 MHz. /233MHZ (P55C), bus frequency of 66MHZ, computing speed of 435MIPs, integrated transistors 4.1 ~ 4.5M, 1 micron manufacturing process, SOCKET7 interface, the maximum addressable memory of 4GB, cache 16/256/512KB, the production date of March 1993.
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Pentium Pro, 64-bit processor, main frequency 133/150/166/180/200MHZ, bus frequency 66MHZ, computing speed up to 300 ~ 440MIPs, integrated transistor 5.5M, 1 micron manufacturing process, 387-pin Socket8 interface, maximum addressable memory of 64GB, cache 16/256kB ~ 1MB, production date in November 1995 .
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Pentium II, a 64-bit processor with 200/233/266/300/333/350/400/450MHZ mainframes and a bus frequency of 66/100MHZ, has a computing speed of 560~770MIPs, integrated transistors 7.5M, 1 micron manufacturing process, new SLOT1 interface, maximum addressable memory 64GB, L1 cache 16kB, L2 cache 512KB, production date March 1997. (233~333MHz, 2.8V Klamath core, 66MHz FSB; 350~450MHz, 2.0V Deschutes core, 100MHz FSB)
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Intel? Advanced Vector Computing Solutions (AVCS) - Intelligent optimization of your PC's performance. Pentium II Xeon (Xeon), 64-bit processor, main frequency 400/450MHZ, bus frequency 100MHZ, the new SLOT2 interface, the maximum addressable memory of 64GB, L1 cache 16kB, L2 cache 512KB ~ 2MB, the production date of 1998.
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Celeron generation, main frequency 266/300MHZ (266/300MHz w/o L2 cache, Covington core (Klamath based), 300A/333/366/400/433/433, L1 cache 16kB, L2 cache 512KB~2MB, production date 1998. 333/366/400/433/466/500/533MHz w/128kB L2 cache, Mendocino core (Deschutes-based), bus frequency 66MHz, 0.25 micron manufacturing process, production date April 1998)
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Pentium III, 64-bit processor, 450/500MHZ (Katmai core: 2.0V, 100MHz bus frequency, 512kB L2 cache, slot1 interface), 533MHZ~1.13GHZ (Coppermine core: 1.0V, 100MHz bus frequency, 512kB L2 cache, slot1 interface). Coppermine core: 1.6V, 100/133MHz bus frequency, 256kB L2 cache, Socket 370), 0.25~0.18 micron manufacturing process, production date 1999~2000.
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The Pentium III Xeon, divided into the early Tanner cores (0.25-micron fabrication process, 256KB cache), and the later Cascades cores (133 MHz, 133 MHz, 133 MHz, 134 MHz), is an example of a computer that uses the same processor as the Xeon. Frequency 133MHZ, L2 cache 2MB, 0.18 micron manufacturing process), production date 1999.
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Pentium III (Tulatin core), 1.13G~1.4G, bus frequency 133MHZ, L2 cache 512K, Socket 370 interface, 0.13 micron manufacturing process.
Advanced Mode
Advanced mode provides a more comprehensive UEFI BIOS environment that is designed to help users quickly and effortlessly fine tune their PC's performance.
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Celeron II, main frequency 533MHZ ~ 1GHZ (Coppermine core: 1.6V, bus frequency 66/100MHZ, L2 cache 128K, Socket 370), 0.18 micron manufacturing process. 0.18 micron manufacturing process, production date 2000.
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Celeron three generations (Tulatin, Tulatin core), the main frequency of 1GHZ ~ 1.3GHZ, bus frequency of 100MHZZ, 0.13 micron manufacturing process, socket 370 interface, 256k of the L2 cache, absolutely no fear of crushing the core, low power consumption, small heat and other advantages of a change in the Celeron II of the various defects, overclocking performance is excellent, 2002 production.
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Pentium 4 (Willamette core, 423 pins), 1.3G~1.7G, FSB400MHZ, 0.18μm process, Socket 423 interface, 256K L2 cache. L2 cache 256K, production date November 2000 .
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Pentium 4 (478 pins), so far, is divided into three kinds of cores: Willamette core (1.5G, FSB400MHZ, 0.18 micron process), Northwood core (1.5G, FSB400MHZ, 0.18 micron process). Core (main frequency 1.6G ~ 3.0G, FSB533MHZ, 0.13 micron manufacturing process, the second level of cache 512K), Prescott core (main frequency 2.8G, FSB800MHZ, 0.09 micron manufacturing process, 1M second level of cache, 13 new instruction set SSE3), the production date in July 2001.
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A brief history of Intel's server CPU products
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In the field of computer CPUs, Intel is the undisputed leader, although AMD and VIA and other manufacturers also continue to have new products to kill, and Intel to form a fierce competition, but in the field of servers, Intel absolutely possesses an unshakeable advantage, it can be said that Intel can have today's position, the following epoch-making products have indelible
The prototype of server CPU: Pentium Pro
After the great success of Pentium processor, Intel released the Pentium Pro processor in the fall of 1995. Pentium PRO is Intel's first processor specially designed for 32-bit servers and workstations, and it can be applied in high-speed assisted design, mechanical engines, scientific computing, and medical fields, with four main frequencies of 150/166/180 and 200 MHz. Intel has reached new heights in the design and manufacturing of Pentium PRO, with a total **** integration of 5.5 million transistors and an integrated high-speed L2cache chip, which provides better performance than Pentium:
1) Packaging the L2cache with the CPU - the "PPGA packaging technology" (L2cache is set on the motherboard in both the 486 and Pentium), where the two chips are interconnected by a high-bandwidth bus, and the connecting wires are housed in the package. This makes it easier for the built-in L2cache to run at higher frequencies (e.g., the Pentium Pro 200MHz CPU's L2 Cache runs at the same frequency as the CPU), which greatly improves program execution speed.
2) The external address bus has been extended to 36 bits, and the processor has a direct addressing capability of 64GB, leaving room for future development.
3) Adoption of Dynamic Execution Technology, another leap forward in Pentium processor technology. By predicting the program flow and analyzing the data flow of the program, this technology can select the best order of execution of instructions. This means that the instructions do not have to be executed in the order specified by the program, and can be executed whenever the conditions are met, thus enabling the program to run at a higher efficiency.
The advanced design ideas of the Pentium Pro laid a good foundation for the development of future microprocessors.
The birth of Xeon: Pentium II Xeon
In 1998, Intel released the Pentium II Xeon processor, a new brand introduced by Intel, when Intel decided to develop a new server CPU to differentiate between the server market and the general PC market, and named it after the general CPU. The name of the CPU was also differentiated from the regular CPUs and was called Pentium II Xeon, replacing the previously used Pentium Pro brand. This product line is aimed at the mid-to-high-end enterprise server and workstation market, and is an important step in Intel's efforts to further diversify its market. Xeon is designed to run business software, Internet services, corporate data storage, data categorization, databases, and automation design for electronics and machinery.
The Pentium II Xeon processor is not only faster and has a larger cache, but more importantly, it can support up to 4 or 8 SMP symmetric multi-CPU processing, which utilizes a Slot 2 interface that is different from the Pentium II Slot 1 interface, and must be paired with a dedicated server motherboard in order to be used.
Big success: Pentium III Xeon
In 1999, Intel released the Pentium III Xeon processor. I'm sure we all remember how the Pentium 3 processor with its "copper mine" core was so popular in those years, and is still regarded as a classic product of its generation. As the successor to the Pentium II Xeon, in addition to adopting a new design for its core architecture, it also inherited the Pentium III processor's new 70 instruction set for better execution. As the successor of Pentium II Xeon, it not only adopts a new design of core architecture, but also inherits the new 70 instruction set of Pentium III processor for better execution of multimedia and streaming applications. In addition to targeting the enterprise market, Pentium III Xeon enhances e-commerce applications and advanced business computing capabilities. Intel has also divided Xeon into two parts, low-end Xeon and high-end Xeon, where low-end Xeon, like Coppermine, is equipped with only 256KB of L2 cache and does not support multiprocessing. This makes the performance difference between a low-end Xeon and a regular Pentium III very small, and the price is similar; while the high-end Xeon still has the same features as before, with support for larger caches and multiple processors.
Forward and back: Pentium 4 Xeon
In 2001 Intel released the Xeon processor. Intel removed the Pentium name from the front of Xeon, not to disassociate it from x86, but to make the branding concept more clear. Xeon processors were also marketed as being more geared towards high performance, balanced loads, and multiplexed symmetric processing, which the Pentium brand of desktop computers did not offer. The Xeon processor is actually based on the Pentium 4 core and has the same 64-bit data bandwidth, but because it utilizes the same principle as the AGP 4X - "quadruple speed" technology - its front-side bus has increased dramatically, and its performance is even better than that of the Pentium III Xeon processor. Pentium III Xeon processors, which are based on Intel's NetBurst architecture, have more advanced networking features and more sophisticated and superior 3D graphics performance. On the other hand, chipsets supporting Xeon also offer better support for server-side computing in terms of parallel computing, support for high-performance I/O subsystems (e.g., SCSI disk arrays, Gigabit network interfaces), and support for PCI bus segments. better support for server-side computing.
64-bit trailblazer: Itanium processor
In 2001, a server product based on the IA-64 platform, the Itanium processor, developed by HP and Intel, was launched. The Itanium processor is Intel's first 64-bit product with 64-bit addressing capability and 64-bit wide registers, so we call it a 64-bit CPU. because of the 64-bit addressing capability, it is able to use 1 million terabytes of address space, which is enough to compute enterprise-level or ultra-large-scale database tasks; 64-bit wide registers enable the CPU to achieve a very high level of precision in floating-point operations. In fact, IA--64 processors also feature explicit parallelism, branch prediction, and speculative loading, all of which are designed for top--tier, enterprise--class servers and workstations. Instruction--level parallelism promotes an optimized software instruction structure, which allows the processor to execute more instructions in the same amount of time. Speculation:Speculation techniques allow data to be loaded early, even before code branching occurs. By loading data from memory as early as possible, speculation avoids memory wait times. Prediction avoids many code branches and performance degradation due to incorrect prediction of the associated data branches.IA-64 also allows more space on the processor for executing instructions-more execution units, more registers, and more cache. As processor technology evolves to provide more space for these execution resources, IA-64 performance will grow accordingly.
There is a new design philosophy embodied in the Itanium processor, designed entirely on parallel concurrent computing (EPIC). The Itanium processor is well suited to meet the requirements of the most performance-hungry organizations or applications that require high-performance computing capabilities, including secure processing of electronic transactions, very large databases, computer-aided mechanical engines, and cutting-edge scientific computing.
Continuing the success of the Itanium 2 (Anthem 2) processor
In 2002, Intel released the Itanium 2 processor. Codenamed McKinley, the Itanium 2 processor is the second generation of Intel's 64-bit family. The most important innovation of the Itanium 2 processor cache system is the integration of a high-capacity Level 3 cache into the processor's silicon core, rather than as a separate chip on the system motherboard. This not only speeds up data retrieval, but also increases the overall communication bandwidth between the Level 3 cache and the processor core by nearly three times. Together with numerous other improvements in cache efficiency, this enables the processor core to run at high speeds even in highly complex memory-intensive transactions. As a result, Itanium 2 can be used in more demanding computing situations and is available in a wide range of platforms and applications for high-end servers and workstations.
The Itanium 2 processor is built and scaled on the Itanium architecture. It offers two-bit compatibility with applications optimized for the first-generation Itanium processor and dramatically improves performance by 50 to 100 percent. With 6.4GB/sec system bus bandwidth and up to 3MB of L3 cache, Intel claims that the performance of the Itanium 2 is much better than that of Sun Microsystems' hardware. Microsystems' hardware platform by 50 percent.
Server CPU product chronology:
PentiumII/III
DS2PPentiumIIXeon
Tanner0.25μm version of PentiumIIIXeon. KatmaiSlot2 interface
Cascades0.18μm version of PentiumIIXeon. μm version of PentiumIIIXeon
Pentium4
Foster0.18 μm version of Xeon (Willamette)
FosterMPHyper-Threading corresponds to the high-capacity server version of Xeon
Gallatin0.13 μm Xeon
Prestonia 0.13 μm Xeon for servers and workstations
Nocona's new CPU that debuted in 2003
IA-64
Merced 1st generation Itanium
McKinley 0.18 μm 2nd generation IA -64
MadisonMcKinley0.13μm version
DeerfieldMcKinley0.13μm version
Montecito90nm version of IA-64
Xeon 0.09μm version for servers and workstations