Traditional high-pressure injection molding has an injection pressure in the range of 350-1300Bar;
Kane KY's low-pressure injection molding, with an injection pressure in the range of 1.5-40Bar, is a new type of injection molding process between traditional potting and high-pressure injection molding.
In addition, the injection temperature of low pressure injection molding process is relatively low, generally in the range of 180-240 ℃, high pressure injection molding is generally in the range of 230-300 ℃, so high pressure injection molding can not be injected into the glue-sensitive components, and low pressure injection molding is very suitable for replacing the traditional potting used as a package for electronic components.