Key Features:
1. Integrated Wireless LAN Capability: With the integrated wireless LAN capability of Intel Centrino Mobile Computing Technology, there is no need for cables, boards and antennas. With Intel Centrino Mobile Computing Technology's Wi-Fi authentication technology, information can be accessed and communicated live over wireless Internet and network connections. Many public*** Wi-Fi networks (called "wireless hotspots") around the world provide this connectivity. In addition, Intel Centrino mobile computing technology is designed to support a wide range of industrial wireless local area network (WLAN) security standards and leading third-party security solutions, such as Cisco compatibility extensions, so you can be sure that your data is protected by the latest wireless security standards. In addition, Intel will work with vendors such as Cisco*** to support leading third-party security solutions.
2. Superior mobile computing performance: In the face of today's multitasking mobile computing life, superior mobile computing performance is equally desirable when away from home or the office. As mobile computing applications become more complex and demand faster, more efficient computing performance, Intel Centrino mobile computing technology is specifically designed to deliver faster instruction execution with lower power consumption to fully meet the needs of emerging and future applications. Some of the key features of Intel Centrino Mobile Computing Technology that support superior mobile computing performance include: Micro-operation fusion, which combines operations to reduce the time and energy required to execute instructions. Energy-efficient L2 cache and enhanced data prefetching capabilities reduce the number of off-chip memory accesses and increase the availability of valid data within the L2 cache. Advanced instruction prediction capability eliminates duplicate CPU processing by analyzing past behavior and predicting which operations may be needed in the future. A dedicated stack manager can improve processing efficiency by performing common housekeeping functions.
3. Support for sustained battery life: Intel Centrino mobile computing technology delivers outstanding mobile computing performance while supporting sustained battery life with energy-efficient technologies such as Smart Power Distribution, which distributes system power to applications with the highest processor demand. New power-saving transistor technology optimizes energy usage and consumption to reduce CPU power consumption. Enhanced Intel SpeedStep technology supports dynamic enhancement of application performance and power utilization.
4. Wide range of notebook designs: Intel Centrino mobile computing technology supports the latest notebook designs from thin and light to full-size. To integrate high-performance processors into the latest slim and ultra-slim laptops, tablets, and other leading computer designs, Intel Centrino Mobile Computing Technology uses Micro FCPGA (Flip Pin Grid Array) and FCBGA (Flip Ball Grid Array) technologies to support packaged processor chips optimized specifically for thinner and lighter laptop designs. The smaller form factor of new laptops requires specialized consideration of lower power consumption to control heat dissipation. To meet this requirement, Intel Centrino mobile computing technology uses low voltage (LV) and ultra-low voltage (ULV) technologies to support processors running at lower voltages to reduce heat dissipation in flat panel and ultra-slim design laptops
Centrino II: The new Intel Centrino mobile computing technology platform, codenamed Sonoma, is powered by the 90nm Dothan core (2MB L2 cache, 533MHz FSB) PentiumM processor, the new Aviso chipset, and the new wireless module Calexico2 (Intel PRO/Wireless 2915ABG or 2200BG WLAN component) are the three main components.
The addition of new technologies: the new Intel Graphics Media Accelerator 900 graphics core, an energy-efficient 533MHz front-side bus, and dual-channel DDR2 memory support helps systems with the mobile Intel 915GM Express Chipset with Integrated Graphics get double the graphics performance boost. In addition, the new Intel Centrino mobile computing technology supports the latest PCI Express graphics interface, which provides up to four times the graphics bandwidth for high-end systems with discrete graphics cards. Options such as TV tuners, Intel High Definition Audio with Dolby Digital and 7.1 surround sound support, personal video recorders and remote controls are also available with system manufacturer support, while continuing to provide the battery life benefits of Intel Centrino mobile computing. Features that help manufacturers achieve long battery life include Display Power Saver 2.0, low-power DDR2 memory support, and enhanced Intel SpeedStep technology.
1. New PentiumM processor: The Dothan processor builds on Banias by introducing many of the features of the more mature NetBurst architecture and adding Enhanced Data Prefecher and Enhanced Register Data Retrieval.
There are three main changes to the Dothan processor from the Banias core product. First, the manufacturing process has been upgraded from 0.13 microns to a new 90 nanometer process that allows for smaller and faster transistors, so the Dothan processor is essentially the same size and power consumption while doubling the Cache compared to the Banias. Secondly, Dothan utilizes a new "strain silicon" material technology. According to Intel's test, the electron flow speed in strain silicon is much faster than that of other current silicon materials, which makes Dothan's main frequency get a big boost, and has reached a maximum of 2.13G. In addition, Dothan's L2 cache is upgraded to 2MB, which increases performance by 20% or so compared to the original Banias Pentium-M processor of the same frequency, while keeping the power consumption roughly the same. The Dothan CPU achieves energy saving and consumption reduction in many ways, its L2 cache adopts 8-way joint operation mode, and each way is divided into 4 power consumption areas, because only one of them can be used at the same time during the processor's working process, so the power consumption areas that can't be used at present can be shut down under the control of the special stack management technology, which greatly reduces the L2 cache's power consumption. This greatly reduces the power consumption of the L2 cache. In addition, Dothan CPUs support the new Enhanced SpeedStep technology, which is performed entirely by the processor's voltage regulation mechanism and has little to do with the chipset. Switching between these modes is entirely automatic, based on the load of the processor at the time, which results in a more energy efficient processor with precise control over the power consumption.
2. New Aviso Chipset: The core of the Sonoma platform, in addition to the Dothan CPU, is the Alviso (915PM/915GM) chipset, which includes many of the latest technologies, including support for the PCI Express bus architecture, as well as support for the low-power DDR-2 memory and the new EG3 graphics core. In addition, the Alviso chipset is paired with a mobile southbridge chip codenamed ICH6-M, which provides four Serial ATA hard disk interfaces and integrates a new generation of Azalia sound chips with a new ExpressCard external expansion port. "As a replacement for Centrino, Sonoma's wireless, display and audio capabilities have been further enhanced, and computing speeds have been increased by approximately 30%.
The PCI Express bus will completely replace the AGP bus and PCI bus on the Alviso chipset. This is a most welcome advancement, and there will be no need to struggle with bottlenecks in data transfer. The huge increase in bandwidth for video processing and multimedia production cannot be ignored. The PCI Express bus is also characterized by low power consumption, which is also crucial for notebooks. At the same time, the new system will also be equipped with high-performance, low-power DDRII memory, and support for dual-channel, will be able to provide a maximum of 8.4G / s bandwidth, which will be able to meet the development needs of the processor for a long time to come, but also for the performance of the integrated graphics card to improve the great benefits. Along with the Sonoma platform, Intel will launch the "Extreme Graphics 3" integrated display chip, hardware support for PS 2.0 and VS 2.0, as well as DirectX 9, while also using a special power management technology to reduce power consumption, which allows users to make a free choice between performance and power consumption. The new graphics memory integration package model is a new way for users to choose between performance and power consumption.
The "Azalia" audio technology integrated on Sonoma's mobile platforms offers outstanding performance in terms of both parallel processing and standardized architecture, with support for audio sample rates up to 32-bit/192kHz and 7.1 channels. In addition, Azalia will be controlled by a unified bus driver, so that any Azalia audio device can use the same driver. Azalia audio technology will bring unprecedented audio performance to notebook PCs, and with increasingly powerful mobile displays, will make gaming on your notebook a pleasure.
The PCMCIA Card, which has been used for years on Sonoma's mobile platforms, will also see a big change. With the proliferation of high-bandwidth video and web applications, the traditional PCMCIA PC Card is becoming increasingly irrelevant. There is an urgent need for a new technology to replace it, and ExpressCard is such a technology, which will be lighter, thinner, faster and easier to use than traditional PC Card technology. In addition to the ExpressCard34 for laptops, there is also the ExpressCard54 for desktop computers, thus building another bridge between laptops and desktops. The ExpressCard is likely to replace the PC Card, which has been in use for many years, because of its better balance of form factor, performance, reliability, adaptability, hot-swappability, and automated setup.
3. New wireless module Calexico2: One of the most important trends in mobile computing is the massive rollout of the use of wireless LANs (Wi-Fi). Support for wireless connectivity is a core component of Intel's Centrino technology. But the Calexico2 wireless module is significantly less innovative than the Dothan processor and Alviso chipset, because the same technology was actually available as a stand-alone product two years ago, and Intel simply integrated it into the Sonoma mobile platform and named it Calexico2.
On the Sonoma mobile platform, the wireless communication module, which is an important part of Centrino's technology, will be equipped with the latest Calexico2 wireless communication module, which adds support for IEEE 802.11a/g wireless technology on top of IEEE 802.11b support. The IEEE 802.11a works in the 5.0GHz band, which can easily avoid interference from the 2.4GHz band. In addition to the different frequency bands, IEEE 802.11a adopts an improved information coding method, which enables transmission speeds of up to 54 Mbps, while the IEEE 802.11g technology has the characteristics of both IEEE 802.11a and IEEE 802.11b. IEEE 802.11g operates in the 2.4 GHz band, which realizes a similarity with the IEEE 802.11b technology. IEEE 802.11g operates in the 2.4GHz band, which makes it compatible with IEEE 802.11b, but IEEE 802.11g uses the same information encoding method as IEEE 802.11a, which also makes it possible to achieve a transmission frequency of 54Mbps.