No. Wafer laser cutting machine and photolithography machine are two different types of equipment. Wafer laser cutting machine is a device that uses laser technology to cut semiconductor wafers. Semiconductor wafers are the basic materials for manufacturing integrated circuits and microelectronic devices. Using silicon wafers or other semiconductor materials, photolithography machines are commonly used equipment in the semiconductor chip manufacturing process. They are used to project the pattern of the chip onto the silicon wafer (or wafer) and form the pattern on the chip by exposing the photosensitive coating. , Wafer laser cutting machines are mainly used for cutting and processing of semiconductor wafers, while photolithography machines are used for pattern definition and manufacturing in the manufacturing process of semiconductor chips.