U.S. Standards on Bonded Alloy Wires

ASTMF2516-14 and MS5832F.

1. ASTMF2516-14: Developed by the American Society for Testing and Materials (ASTM), it specifies the mechanical properties, chemical composition, and processing requirements for shape memory alloy bonding alloy wires used in medical devices.

2. MS5832F: Developed by the American Aerospace Materials Specification Council for nickel-based montmorillonite alloy bonding alloy wires for use in high-temperature environments for aerospace and other high-performance applications.