1. Logic Functionality and Programmability: The chip contains 715 LAB/CLB cells and 9152 logic elements, providing highly programmable logic functions. The programmability enables personalized configuration and function expansion according to different application scenarios.
2. Low-power features: The low-power design is suitable for low-power applications that require extended operation, such as portable electronic devices and embedded systems.
3. High-performance performance: High-performance processing capability makes it ideal for high-speed data processing and communication applications.
4. Wide range of application scenarios: Applications include high-speed communications, digital signal processing, video and audio processing, automation and control systems, medical equipment, military equipment, and more.
5, Interface and Protocol Support: Supports a variety of different interfaces and protocols, such as PCIExpress, GigabitEthernet, USB, DDR3, etc., which facilitates communication and data exchange with other devices or systems.
6. Manufacturing process and specifications: Manufactured using 45nm process, featuring low power consumption and high logic density. The maximum operating frequency is up to 200MHz with good timing performance.
7. Reliability and Stability: Strict design and manufacturing processes, as well as testing and verification processes, ensure stable operation in various environments.