In 1970s, with the application of surface mount technology, solder paste came into being. It is a creamy mixture of solder powder, flux and other additives. At the welding temperature, it can weld the welding elements and printed circuit pads together to form a permanent connection.
Solder paste is mainly composed of flux and solder powder.
Flux is mainly composed of the following main components.
1. activator. It can remove the oxidation substances on the surface of PCB pad and the welding part of parts, and reduce the tension of tin and lead surfaces.
2. Thixotropic agent. Mainly adjust the viscosity and printing function of solder paste to avoid tailing and adhesion in printing.
3. resin. It can increase the adhesion of solder paste and protect and prevent PCB from re-oxidation after welding.
4. Solvent. It can play a uniform role in the process of stirring solder paste, which will affect the service life of solder paste.
Solder powder, also known as tin powder, is mainly composed of tin lead, tin bismuth and tin-silver-copper alloy. Taizhou semiconductor packaging