pcb board production process:
1, open material (CUT)
Cut the very first copper-clad board into boards.
2, drilling
According to the material, the hole diameter is drilled in the corresponding position on the plate.
3, copper deposition
Using chemical methods to deposit a thin layer of copper on the walls of the insulating holes.
4, Graphics transfer
Let the image on the production film be transferred to the board.
5, graphic plating
Let the hole and line copper layer plating to a certain thickness (20-25um), and finally achieve the final PCB board finished copper thickness requirements.
6, the film
NaOH solution to allow the removal of anti-plating covering the film layer of non-line copper layer is exposed.
7, etching
Chemical reaction method to the non-line parts of the copper layer corrosion.
8, green oil
Transferring the graphics of green oil film to the board, can protect the line and prevent the line from soldering parts on the tin.
9, silkscreen characters
To print the desired text and information on the board.
10, surface treatment
Because the bare copper is exposed to air for a long time, it is easy to oxidize moisture, so the surface treatment, the common surface treatment of spray tin, immersion gold, OSP, immersion tin, immersion silver, nickel and palladium gold, electric hard gold, electric gold fingers, and so on.
11, molding
Let the PCB to CNC molding machine to cut into the required form factor.
12, test
Check the status of the analog board to see if there are short circuits and other defects.
13, final inspection
Check the board's appearance, size, aperture, board thickness, markings and so on.